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1. (WO2017110372) POLYAMIDE RESIN COMPOSITION, KIT, PROCESS FOR PRODUCING MOLDED ARTICLE, AND MOLDED ARTICLE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110372 International Application No.: PCT/JP2016/085149
Publication Date: 29.06.2017 International Filing Date: 28.11.2016
IPC:
C08L 77/06 (2006.01) ,B29C 65/16 (2006.01) ,C08G 69/26 (2006.01) ,C08K 3/34 (2006.01) ,C08K 7/14 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77
Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
06
Polyamides derived from polyamines and polycarboxylic acids
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
02
by heating, with or without pressure
14
using wave energy or particle radiation
16
Laser beam
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
69
Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
02
Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids
26
derived from polyamines and polycarboxylic acids
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
02
Fibres or whiskers
04
inorganic
14
Glass
Applicants:
三菱エンジニアリングプラスチックス株式会社 MITSUBISHI ENGINEERING-PLASTICS CORPORATION [JP/JP]; 東京都港区東新橋一丁目9番2号 9-2, Higashi-shinbashi 1-chome, Minato-ku, Tokyo 1050021, JP
Inventors:
岡元 章人 OKAMOTO Fumihito; JP
Agent:
特許業務法人特許事務所サイクス SIKS & CO.; 東京都中央区京橋一丁目8番7号 京橋日殖ビル8階 8th Floor, Kyobashi-Nisshoku Bldg., 8-7, Kyobashi 1-chome, Chuo-ku, Tokyo 1040031, JP
Priority Data:
2015-25496025.12.2015JP
Title (EN) POLYAMIDE RESIN COMPOSITION, KIT, PROCESS FOR PRODUCING MOLDED ARTICLE, AND MOLDED ARTICLE
(FR) COMPOSITION DE RÉSINE DE POLYAMIDE, KIT, PROCÉDÉ DE PRODUCTION D’UN ARTICLE MOULÉ, ET ARTICLE MOULÉ
(JA) ポリアミド樹脂組成物、キット、成形品の製造方法および成形品
Abstract:
(EN) Provided are: a polyamide resin composition capable of providing molded articles having a high light transmission; a kit including the polyamide resin composition; a process for producing a molded article; and a molded article. The polyamide resin composition comprises: 25.0-59.95 wt% polyamide resin made up of constituent units derived from one or more dicarboxylic acids and constituent units derived from one or more diamines, 70 mol% or more of the diamine-derived constituent units being derived from xylylenediamine and 70 mol% or more of the dicarboxylic-acid-derived constituent units being derived from a C9-18 aliphatic dicarboxylic acid; 40-70 wt% glass fibers; and a light-transmitting dye. When the polyamide resin composition is examined in accordance with ISO 13468-1 and ISO 13468-2, the light transmission at a wavelength of 800 nm is 48% or greater and the light transmission at a wavelength of 1,064 nm is 55% or greater.
(FR) La présente invention concerne : une composition de résine de polyamide permettant d’obtenir des articles moulés présentant une haute transmission de la lumière ; un kit comprenant la composition de résine de polyamide ; un procédé de production d’un article moulé ; et un article moulé. La composition de résine de polyamide comprend : de 25,0 à 59,95 % en poids de résine de polyamide constituée de motifs constitutifs dérivés d’un ou de plusieurs acides dicarboxyliques et de motifs constitutifs dérivés d’une ou plusieurs diamines, 70 % en mole ou plus des motifs constitutifs dérivés de diamine étant dérivés de xylylènediamine et 70 % en mole ou plus des motifs constitutifs dérivés d’acide dicarboxylique étant dérivés d’un acide dicarboxylique aliphatique en C9 à C18 ; de 40 à 70 % en pds de fibres de verre ; et un colorant de transmission de lumière. Lorsque la composition de résine de polyamide est examinée selon les normes ISO 13468-1 et ISO 13468-2, la transmission de lumière sous une longueur d’onde de 800 nm est de 48 % ou plus et la transmission de lumière à une longueur d’onde de 1 064 nm est de 55 % ou plus.
(JA) 光線透過率の高い成形品を提供可能なポリアミド樹脂組成物、前記ポリアミド樹脂組成物を用いたキット、成形品の製造方法および成形品の提供。 ジカルボン酸由来の構成単位とジアミン由来の構成単位から構成され、ジアミン由来の構成単位の70モル%以上がキシリレンジアミンに由来し、ジカルボン酸由来の構成単位の70モル%以上が炭素数9~18の脂肪族ジカルボン酸に由来するポリアミド樹脂25.0~59.95重量%と、ガラス繊維40~70重量%と、光透過性色素を含むポリアミド樹脂組成物であって、前記ポリアミド樹脂組成物は、ISO13468-1およびISO13468-2に従って測定した波長800nmにおける光線透過率が48%以上であり、波長1064nmにおける光線透過率が55%以上である、ポリアミド樹脂組成物。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108473762EP3395903US20190002692