Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017110326) CURABLE COMPOSITION, CURED OBJECT, OVERCOAT FILM, COATED FLEXIBLE WIRING BOARD, AND PROCESS FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110326 International Application No.: PCT/JP2016/084164
Publication Date: 29.06.2017 International Filing Date: 17.11.2016
IPC:
C08L 75/06 (2006.01) ,C08G 18/42 (2006.01) ,C08K 3/34 (2006.01) ,C08K 3/36 (2006.01) ,C08L 63/00 (2006.01) ,C09D 7/12 (2006.01) ,C09D 175/04 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
75
Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
04
Polyurethanes
06
from polyesters
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18
Polymeric products of isocyanates or isothiocyanates
06
with compounds having active hydrogen
28
characterised by the compounds used containing active hydrogen
40
High-molecular-weight compounds
42
Polycondensates having carboxylic or carbonic ester groups in the main chain
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7
Features of coating compositions, not provided for in group C09D5/88
12
Other additives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
175
Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
04
Polyurethanes
Applicants:
昭和電工株式会社 SHOWA DENKO K.K. [JP/JP]; 東京都港区芝大門一丁目13番9号 13-9, Shibadaimon 1-chome, Minato-ku, Tokyo 1058518, JP
Inventors:
大賀 一彦 OOGA, Kazuhiko; JP
村田 直樹 MURATA, Naoki; JP
鈴木 快 SUZUKI, Kai; JP
Agent:
青木 篤 AOKI, Atsushi; JP
石田 敬 ISHIDA, Takashi; JP
古賀 哲次 KOGA, Tetsuji; JP
蛯谷 厚志 EBITANI, Atsushi; JP
出野 知 DENO, Satoru; JP
胡田 尚則 EBISUDA, Hisanori; JP
Priority Data:
2015-25489625.12.2015JP
Title (EN) CURABLE COMPOSITION, CURED OBJECT, OVERCOAT FILM, COATED FLEXIBLE WIRING BOARD, AND PROCESS FOR PRODUCING SAME
(FR) COMPOSITION DURCISSABLE, OBJET DURCI, FILM DE COUVERTURE AVEC DÉPASSEMENT, CARTE DE CÂBLAGE FLEXIBLE REVÊTUE, ET PROCÉDÉ DE PRODUCTION ASSOCIÉ
(JA) 硬化性組成物、硬化物、オーバーコート膜、被覆フレキシブル配線板およびその製造方法
Abstract:
(EN) A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.
(FR) La présente invention concerne une composition durcissable permettant de former un film de couverture avec dépassement destiné à des cartes de câblage flexibles, la composition durcissable étant efficace pour assurer un faible gauchissement, améliorer l'adhérence aux substrats, la souplesse, la propriété d'inhibition de la rupture de câble, et la fiabilité à long terme. La composition durcissable selon la présente invention comprend un polyuréthanne (constituant a) renfermant des groupes carboxyle et une concentration en cycle aromatique de 0,1 mmole/g à 6,5 mmoles/g et contenant un résidu organique issu d'un polyisocyanate, un solvant (constituant b), et un composé (constituant c) ayant au moins deux groupes époxy dans la molécule.
(JA) フレキシブル配線板用オーバーコート膜を形成するための硬化性組成物において、基材との密着性、低反り性、可撓性、断線抑制性および長期信頼性を改善する。本発明の硬化性組成物は、(成分a)カルボキシル基を有し、かつ芳香環濃度が0.1~6.5mmol/gである、ポリイソシアネートから誘導される有機残基を含有するポリウレタン、(成分b)溶剤、および(成分c)1分子中に2個以上のエポキシ基を有する化合物を含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180066194CN108368336EP3395900IN201817022106US20180355195