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1. (WO2017110198) ELASTIC WAVE DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110198 International Application No.: PCT/JP2016/079478
Publication Date: 29.06.2017 International Filing Date: 04.10.2016
IPC:
H03H 9/25 (2006.01) ,H01L 21/60 (2006.01) ,H03H 9/72 (2006.01)
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25
Constructional features of resonators using surface acoustic waves
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
70
Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source
72
Networks using surface acoustic waves
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
高田 忠彦 TAKADA, Norihiko; JP
矢田 優 YATA, Masaru; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2015-24869121.12.2015JP
Title (EN) ELASTIC WAVE DEVICE
(FR) DISPOSITIF À ONDES ÉLASTIQUES
(JA) 弾性波装置
Abstract:
(EN) Provided is an elastic wave device in which a metal bump of an elastic wave element with a relatively large planar area tends not to delaminate, even when heat is added. An elastic wave device 1 in which a first elastic wave element 11 having a large plane area as viewed from above, and a second elastic wave element 12 having a small plane area as viewed from above are mounted on a package substrate 2 interposed by first metal bumps 16a to 16f and second metal bumps 26a to 26f, respectively. A sealing resin layer 5 is provided so as to cover the first elastic wave element 11 and the second elastic wave element 12. The first metal bumps 16a to 16f are larger than the second metal bumps 26a to 26f.
(FR) La présente invention concerne un dispositif à ondes élastiques dans lequel une bosse métallique d’un élément à ondes élastiques avec une aire plane relativement grande a tendance à ne pas se décoller, même lorsque de la chaleur est ajoutée. Un dispositif à ondes élastiques 1 dans lequel un premier élément à ondes élastiques 11 ayant une grande aire plane observée par-dessus, et un deuxième élément à ondes élastiques 12 ayant une petite aire plane observée par-dessus sont montés sur un substrat de boîtier 2 intercalés par des premières bosses métalliques 16a à 16f et des deuxièmes bosses métalliques 26a à 26f, respectivement. Une couche de résine de scellement 5 est disposée de manière à recouvrir le premier élément à ondes élastiques 11 et le deuxième élément à ondes élastiques 12. Les premières bosses métalliques 16a à 16f sont plus grandes que les deuxièmes bosses métalliques 26a à 26f.
(JA) 熱が加わった場合でも、平面積が相対的に大きい弾性波素子の金属バンプの剥離が生じ難い弾性波装置を提供する。 パッケージ基板2上に、平面視した場合の平面積が大きい第1の弾性波素子11と、平面視した場合の平面積が小さい第2の弾性波素子12とが、それぞれ、第1の金属バンプ16a~16f及び第2の金属バンプ26a~26fを介して実装されており、封止樹脂層5が、第1の弾性波素子11及び第2の弾性波素子12を覆うように設けられており、第1の金属バンプ16a~16fが、第2の金属バンプ26a~26fよりも大きくされている、弾性波装置1。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180050737CN108352822