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1. (WO2017110179) CIRCUIT SUBSTRATE, FILTER CIRCUIT, AND CAPACITANCE ELEMENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110179 International Application No.: PCT/JP2016/077791
Publication Date: 29.06.2017 International Filing Date: 21.09.2016
IPC:
H03H 7/075 (2006.01) ,H05K 3/46 (2006.01)
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
7
Multiple-port networks comprising only passive electrical elements as network components
01
Frequency selective two-port networks
075
Ladder networks, e.g. electric wave filters
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
東條 淳 TOUJO, Atsushi; JP
Agent:
特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.; 大阪府大阪市北区中之島二丁目2番7号 中之島セントラルタワー Nakanoshima Central Tower, 2-7, Nakanoshima 2-chome, Kita-ku, Osaka-shi, Osaka 5300005, JP
Priority Data:
2015-25182924.12.2015JP
Title (EN) CIRCUIT SUBSTRATE, FILTER CIRCUIT, AND CAPACITANCE ELEMENT
(FR) SUBSTRAT DE CIRCUIT, CIRCUIT DE FILTRE ET ÉLÉMENT CAPACITIF
(JA) 回路基板、フィルタ回路およびキャパシタンス素子
Abstract:
(EN) The present invention is a circuit substrate (2) having a capacitor mounted thereon. The circuit substrate (2) is provided with: an electrode (T1) to which a capacitor (C1) is connected; an inductor (L1) which is connected to the electrode (T1); an inductor (L2) which is connected to the electrode (T1); an electrode (T4) which is connected to the inductor (L2); an electrode (T3) which is connected to the inductor (L1); and a ground electrode (GND) in which a capacitance is formed between the electrode (T3) and the ground electrode. The capacitance formed between the electrode (T3) and the ground electrode (GND) is equal to or greater than the capacitance of the capacitor (C1).
(FR) La présente invention concerne un substrat (2) de circuit comportant un condensateur monté sur celui-ci. Le substrat (2) de circuit comporte : une électrode (T1) à laquelle est connecté un condensateur (C1) ; une bobine d'induction (L1) qui est connectée à l'électrode (T1) ; une bobine d'induction (L2) qui est connectée à l'électrode (T1) ; une électrode (T4) qui est connectée à la bobine d'induction (L2) ; une électrode (T3) qui est connectée à la bobine d'induction (L1) ; et une électrode de masse (GND) dans laquelle une capacité est formée entre l'électrode (T3) et l'électrode de masse. La capacité formée entre l'électrode (T3) et l'électrode de masse (GND) est supérieure ou égale à la capacité du condensateur (C1).
(JA) 本発明は、コンデンサを実装する回路基板(2)である。回路基板(2)は、コンデンサ(C1)を接続するための電極(T1)と、電極(T1)と接続するインダクタ(L1)と、電極(T1)と接続するインダクタ(L2)と、インダクタ(L2)と接続される電極(T4)と、インダクタ(L1)と接続される電極(T3)と、電極(T3)との間で容量を形成する接地電極(GND)とを備えている。電極(T3)と接地電極(GND)とで形成される容量がコンデンサ(C1)の容量以上である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108141190US20180212583