Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017110121) LINE BEAM LIGHT SOURCE, LINE BEAM IRRADIATION DEVICE, AND LASER LIFT OFF METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110121 International Application No.: PCT/JP2016/071345
Publication Date: 29.06.2017 International Filing Date: 21.07.2016
IPC:
H01S 5/022 (2006.01) ,B23K 26/03 (2006.01) ,B23K 26/073 (2006.01) ,B23K 26/57 (2014.01) ,H01S 5/062 (2006.01) ,H01S 5/40 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03
Observing the workpiece
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
073
Shaping the laser spot
[IPC code unknown for B23K 26/57]
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
06
Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
062
by varying the potential of the electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
40
Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02-H01S5/30128
Applicants:
鴻海精密工業股▲ふん▼有限公司 HON HAI PRECISION INDUSTRY CO.,LTD.; 台湾新北市土城區中山路66號 66,Chung Shan Road,Tu-Cheng Dist.,New Taipei City, TW
Inventors:
岸本 克彦 KISHIMOTO Katsuhiko; --
Agent:
奥田 誠司 OKUDA Seiji; JP
Priority Data:
2015-25358625.12.2015JP
Title (EN) LINE BEAM LIGHT SOURCE, LINE BEAM IRRADIATION DEVICE, AND LASER LIFT OFF METHOD
(FR) SOURCE DE LUMIÈRE À FAISCEAU LINÉAIRE, DISPOSITIF D'EXPOSITION À FAISCEAU LINÉAIRE, ET PROCÉDÉ DE DÉCOLLEMENT AU LASER
(JA) ラインビーム光源およびラインビーム照射装置ならびにレーザリフトオフ方法
Abstract:
(EN) A line beam irradiation device (1000) is provided with: a work stage (200); a line beam light source (100) which irradiates a workpiece (300) placed on the work stage (200) with a line beam; and a transport device (250) which moves the work stage (200) and/or the line beam light source (100) so as to move the position at which the line beam is irradiated onto the workpiece in a direction intersecting the line beam. The line beam light source includes a plurality of semiconductor laser elements, and a support member supporting the plurality of semiconductor laser elements. The plurality of semiconductor laser elements are arranged along an identical line extending in a fast-axis direction, wherein laser light emitted from respective light-emitting regions of the semiconductor laser elements expands parallel to the identical line and forms the line beam.
(FR) L'invention concerne un dispositif d'exposition à faisceau linéaire (1000) comprenant : une platine de travail (200); une source de lumière à faisceau linéaire (100) qui expose une pièce (300) placée sur la platine de travail (200) à un faisceau linéaire; et un dispositif de transport (250) qui déplace la platine de travail (200) et/ou la source de lumière à faisceau linéaire (100) de manière à déplacer la position à laquelle le faisceau linéaire est incident sur la pièce dans une direction croisant le faisceau linéaire. La source de lumière à faisceau linéaire comprend une pluralité d'éléments laser à semi-conducteur, et un élément de support soutenant la pluralité d'éléments laser à semi-conducteur. La pluralité d'éléments laser à semi-conducteur sont agencés le long d'une même ligne s'étendant dans une direction d'axe rapide, la lumière laser émise par des zones d'émission de lumière respectives des éléments laser à semi-conducteur se déployant parallèlement à ladite ligne et formant le faisceau linéaire.
(JA) ラインビーム照射装置(1000)は、ワークステージ(200)と、ワークステージ(200)上に置かれたワーク(300)をラインビームで照射するラインビーム光源(100)と、ワーク上におけるラインビームの照射位置をラインビームに交差する方向に移動させるようにワークステージ(200)およびラインビーム光源(100)の少なくとも一方を移動させる搬送装置(250)とを備える。ラインビーム光源は、複数の半導体レーザ素子と、複数の半導体レーザ素子を支持する支持体とを有する。複数の半導体レーザ素子は、速軸方向に延びる同一ラインに沿って配列されており、半導体レーザ素子のそれぞれの発光領域から出射されたレーザ光は、同一ラインに平行に拡がってラインビームを形成する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108886232