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1. (WO2017110052) PASTE THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR COMPONENT, SEMICONDUCTOR MOUNTED ARTICLE, METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTED ARTICLE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/110052 International Application No.: PCT/JP2016/005062
Publication Date: 29.06.2017 International Filing Date: 06.12.2016
IPC:
B23K 35/363 (2006.01) ,C08G 65/18 (2006.01) ,H01B 1/22 (2006.01) ,H01L 21/60 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
36
Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
362
Selection of compositions of fluxes
363
for soldering or brazing
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
65
Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02
from cyclic ethers by opening of the heterocyclic ring
04
from cyclic ethers only
06
Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
16
Cyclic ethers having four or more ring atoms
18
Oxetanes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP/JP]; 大阪府大阪市中央区城見2丁目1番61号 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 5406207, JP
Inventors:
福原 康雄 FUKUHARA, Yasuo; --
山口 敦史 YAMAGUCHI, Atsushi; --
Agent:
鎌田 健司 KAMATA, Kenji; JP
前田 浩夫 MAEDA, Hiroo; JP
Priority Data:
2015-25467425.12.2015JP
2015-25467525.12.2015JP
2015-25467625.12.2015JP
2015-25467725.12.2015JP
Title (EN) PASTE THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR COMPONENT, SEMICONDUCTOR MOUNTED ARTICLE, METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTED ARTICLE
(FR) COMPOSITION DE RÉSINE THERMODURCISSABLE EN PÂTE, COMPOSANT SEMI-CONDUCTEUR, ARTICLE MONTÉ SEMI-CONDUCTEUR, PROCÉDÉ DE FABRICATION DE COMPOSANT SEMI-CONDUCTEUR, ET PROCÉDÉ DE FABRICATION D'ARTICLE MONTÉ SEMI-CONDUCTEUR
(JA) ペースト状熱硬化性樹脂組成物、半導体部品、半導体実装品、半導体部品の製造方法、半導体実装品の製造方法
Abstract:
(EN) Provided is a paste thermosetting resin composition which does not inhibit melting and aggregation of a soldering powder during soldering. This paste thermosetting resin composition contains a soldering powder, a thermosetting resin binder, an activator, and a thixotropic additive, the melting point of the soldering powder being 100°C to 240°C, and the thermosetting resin binder including a bifunctional or greater oxetane compound and/or a benzoxazine compound having two or more benzoxazine rings.
(FR) La présente invention concerne une composition de résine thermodurcissable en pâte qui n'inhibe pas la fusion et l'agrégation d'une poudre à souder pendant le soudage. La composition de résine thermodurcissable en pâte de la présente invention comprend une poudre à souder, un liant de résine thermodurcissable, un activateur et un additif thixotrope, le point de fusion de la poudre à souder étant de 100°C à 240°C, et le liant de résine thermodurcissable comprenant un composé d'oxétane bifonctionnel ou plus et/ou un composé benzoxazine ayant deux noyaux benzoxazines ou plus.
(JA) 半田付けの際に半田粉の溶融及び凝集を阻害しないペースト状熱硬化性樹脂組成物を提供する。 本発明のペースト状熱硬化性樹脂組成物は、半田粉と、熱硬化性樹脂バインダーと、活性剤と、チクソ性付与剤とを含有し、半田粉の融点が100℃以上240℃以下であり、熱硬化性樹脂バインダーが、2官能以上のオキセタン化合物及び/又は2個以上のベンゾオキサジン環を有するベンゾオキサジン化合物を含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN107848081US20180233473