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1. (WO2017099492) IMPRINT DEVICE AND METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/099492 International Application No.: PCT/KR2016/014375
Publication Date: 15.06.2017 International Filing Date: 08.12.2016
IPC:
H01L 21/027 (2006.01) ,H01L 21/56 (2006.01) ,H01L 21/02 (2006.01) ,H01L 21/677 (2006.01) ,G03F 7/00 (2006.01) ,H05H 1/46 (2006.01) ,B29C 59/02 (2006.01) ,B29C 59/14 (2006.01) ,B29C 65/00 (2006.01) ,B29C 45/26 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H
PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY- CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
1
Generating plasma; Handling plasma
24
Generating plasma
46
using applied electromagnetic fields, e.g. high frequency or microwave energy
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59
Surface shaping, e.g. embossing; Apparatus therefor
02
by mechanical means, e.g. pressing
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59
Surface shaping, e.g. embossing; Apparatus therefor
14
by plasma treatment
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
17
Component parts, details or accessories; Auxiliary operations
26
Moulds
Applicants:
주식회사 기가레인 GIGALANE CO., LTD. [KR/KR]; 경기도 화성시 삼성1로5길 46 (석우동) (Seoku-dong)46, Samsung 1-ro 5-gil Hwaseong-si Gyeonggi-do 18449, KR
Inventors:
구자붕 GU, Ja Bung; KR
이현우 LEE, Hyun Woo; KR
이남식 LEE, Nam Sik; KR
구황섭 KOO, Hwang Sub; KR
김현제 KIM, Hyun Je; KR
정희석 JUNG, Hee Seok; KR
Agent:
특허법인 주원 B&IP-JOOWON PATENT AND LAW FIRM; 서울시 강남구 언주로 711, 건설회관9층 (논현동) (Nonhyeon-dong) 9th Floor, Construction Center Eonju-ro 711, Gangnam-gu Seoul 06050, KR
Priority Data:
10-2015-017440808.12.2015KR
10-2015-017441608.12.2015KR
10-2016-016609907.12.2016KR
Title (EN) IMPRINT DEVICE AND METHOD
(FR) DISPOSITIF ET PROCÉDÉ D'IMPRESSION
(KO) 임프린트 장치 및 방법
Abstract:
(EN) An imprint device and method are disclosed. The imprint device of the present invention comprises: a surface modifying part for plasma-treating a mold surface having patterns; a coupling part for coupling a mold and a substrate such that the patterns of the plasma-treated mold can be stamped on the substrate; and a separating part for separating the coupled mold and substrate.
(FR) L’invention concerne un dispositif et un procédé d'impression. Le dispositif d'impression selon la présente invention comprend : une partie de modification de surface destinée au traitement au plasma d'une surface de moule ayant des motifs ; une partie de couplage destinée au couplage d'un moule et d'un substrat, de sorte que les motifs du moule traité au plasma puissent être estampés sur le substrat ; et une partie de séparation destinée à séparer le moule et le substrat couplés.
(KO) 임프린트 장치 및 방법이 소개된다. 본 발명의 임프린트 장치는, 패턴이 형성된 몰드 표면을 플라즈마 처리하는 표면 개질부; 플라즈마 처리된 상기 몰드의 패턴이 기판에 스탬핑될 수 있도록 상기 몰드와 상기 기판을 결합시키는 결합부; 및 결합된 상기 몰드와 상기 기판을 분리하는 분리부를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)
Also published as:
CN108292592