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1. (WO2017099415) BASE FILM FOR FPCB AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/099415 International Application No.: PCT/KR2016/014014
Publication Date: 15.06.2017 International Filing Date: 01.12.2016
IPC:
B32B 15/08 (2006.01) ,B32B 15/20 (2006.01) ,B32B 27/28 (2006.01) ,B32B 7/12 (2006.01) ,B32B 37/12 (2006.01) ,H05K 1/03 (2006.01) ,C09J 183/04 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
20
comprising aluminium or copper
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
28
comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
04
characterised by the connection of layers
12
using an adhesive
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
12
characterised by using adhesives
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
Applicants:
주식회사 티디엘 TRUE DIGITAL LEADER CO.,LTD. [KR/KR]; 광주시 북구 첨단벤처소로37번길 67-11(월출동) (Wolchul-dong) 67-11, Cheomdanbencheosoro37beongil Buk-gu Gwangju 61003, KR
Inventors:
김유신 KIM, Yu sin; KR
Agent:
특허법인 남촌 NAMCHON INTERNATIONAL PATENT AND LAW FIRM; 광주시 북구 추암로 249 광주이노비즈센터 7층 707호 (월출동) (Wolchul-dong) 707-ho 7F Gwangju Innobiz center 249 Chuam-ro Buk-gu Gwangju 61003, KR
Priority Data:
10-2015-017323407.12.2015KR
Title (EN) BASE FILM FOR FPCB AND METHOD FOR MANUFACTURING SAME
(FR) FILM DE BASE POUR FPCB ET SON PROCÉDÉ DE FABRICATION
(KO) FPCB용 베이스필름 및 그 제조방법
Abstract:
(EN) The present invention relates to a base film for an FPCB and a method for manufacturing the same, the base film for an FPCB, as a heat resistant plastic film, comprising: a polyimide film used as a base material; a copper foil film attached to the upper and lower portions of the polyimide film and patterned by etching to form a wiring circuit; and a silicone adhesive for bonding the polyimide film and the copper foil film, wherein the silicone adhesive comprises 35 to 45 wt% of liquid silicone, 5 to 15 wt% of aluminum powder, and 50 wt% of organic solvent. According to the present invention, a copper foil can easily be attached to a polyimide film having excellent heat resistance by a silicone adhesive having excellent heat resistance and durability, instead of plating the copper foil on the polymide film, thereby forming a base film for an FPCB having economically excellent heat resistance and durability, and improving production efficiency.
(FR) La présente invention concerne un film de base pour une FPCB et un procédé de fabrication associé, le film de base pour une FPCB, sous la forme d'un film plastique thermorésistant, comprenant : un film de polyimide utilisé comme un matériau de base ; un film de feuille de cuivre fixé sur les parties supérieure et inférieure du film de polyimide et texturé par gravure afin de former un circuit de câblage ; et un adhésif en silicone pour lier le film de polyimide et le film de feuille de cuivre, l'adhésif en silicone comprenant de 35 à 45 % en poids de silicone liquide, de 5 à 15 % en poids de poudre d'aluminium et 50 % en poids d'un solvant organique. Selon la présente invention, une feuille de cuivre peut facilement être fixée à un film de polyimide ayant une excellente thermorésistance par un adhésif en silicone ayant une excellente thermorésistance et une excellente durabilité, au lieu de plaquer la feuille de cuivre sur le film de polyimide, formant ainsi un film de base pour une FPCB ayant une thermorésistance et une durabilité économiquement excellentes et améliorant l'efficacité de production.
(KO) 본 발명은 FPCB용 베이스필름 및 그 제조방법에 관한 것으로서, 내열성 플라스틱 필름으로서 기재로 사용되는 폴리이미드 필름과, 폴리이미드 필름의 상하부에 부착되며 에칭에 의해 패터닝되어 배선회로를 형성하는 동박필름과, 폴리이미드 필름과 동박필름을 접착하는 실리콘 접착제를 포함하여 구성되며, 실리콘 접착제는 액상실리콘 35 ~ 45중량%와 알루미늄 파우더 5 ~ 15 중량%와, 유기용제 50중량%를 포함하며, 내열성이 우수한 폴리이미드 필름에 동박을 도금하지 않고 내열성과 내구성이 우수한 실리콘 접착제에 의해 용이하게 부착할 수 있으므로, 경제적으로 내열성 및 내구성이 우수한 FPCB용 베이스필름을 형성하면서 생산효율을 향상시킬 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)