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1. (WO2017099194) EPOXY RESIN COMPOSITION, PREPREG, EPOXY RESIN COMPOSITION MOLDED BODY, AND CURED PRODUCT THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/099194 International Application No.: PCT/JP2016/086628
Publication Date: 15.06.2017 International Filing Date: 08.12.2016
IPC:
C08G 59/50 (2006.01) ,C08G 61/02 (2006.01) ,C08J 5/24 (2006.01) ,C08L 63/00 (2006.01) ,C08L 65/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
50
Amines
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
61
Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
02
Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
65
Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
Applicants:
日本化薬株式会社 NIPPON KAYAKU KABUSHIKI KAISHA [JP/JP]; 東京都千代田区丸の内二丁目1番1号 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005, JP
Inventors:
松浦 一貴 MATSUURA Kazuki; JP
中西 政隆 NAKANISHI Masataka; JP
Agent:
特許業務法人 信栄特許事務所 SHIN-EI PATENT FIRM, P.C.; 東京都港区西新橋一丁目7番13号 虎ノ門イーストビルディング8階 Toranomon East Bldg. 8F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2015-24246911.12.2015JP
Title (EN) EPOXY RESIN COMPOSITION, PREPREG, EPOXY RESIN COMPOSITION MOLDED BODY, AND CURED PRODUCT THEREOF
(FR) COMPOSITION DE RÉSINE ÉPOXY, PRÉIMPRÉGNÉ, CORPS MOULÉ EN COMPOSITION DE RÉSINE ÉPOXY ET PRODUIT DURCI DE CELLE-CI
(JA) エポキシ樹脂組成物、プリプレグ、エポキシ樹脂組成物成型体及びその硬化物
Abstract:
(EN) Provided is an epoxy resin composition capable of forming a cured product having excellent heat resistance, water absorption, modulus of elasticity, mechanical strength, and electrical reliability while securing curability at a low temperature, a prepreg making use of the epoxy resin composition, a molded body, and a cured product thereof. The epoxy resin composition contains an epoxy resin that is at least bifunctional, an aniline resin having a biphenylene novolac structure, and a protonic acid curing accelerator, wherein the content of the protonic acid curing accelerator is 0.01 to 10.0 parts by weight with respect to 100 parts by weight of the epoxy resin.
(FR) L'invention concerne une composition de résine époxy capable de former un produit durci ayant d'excellentes propriétés de résistance thermique, d'absorption d'eau, de module d'élasticité, de résistance mécanique et de fiabilité électrique, tout en permettant un durcissement à basse température. L'invention concerne également un préimprégné utilisant la composition de résine époxy, un corps moulé et un produit durci de celle-ci. La composition de résine époxy contient une résine époxy qui est au moins bifonctionnelle, une résine aniline ayant une structure novolaque de biphénylène et un accélérateur de durcissement à base d'acide protonique, la teneur en accélérateur de durcissement à base d'acide protonique étant de 0,01 à 10,0 parties en poids pour 100 parties en poids de la résine époxy.
(JA) 低温での硬化性を確保しつつ、優れた耐熱性、吸水率、弾性率、機械強度、電気信頼性を有する硬化物を形成可能なエポキシ樹脂組成物、それを用いたプリプレグ、成型体、それらの硬化物を提供する。エポキシ樹脂組成物は、二官能以上のエポキシ樹脂と、ビフェニレンノボラック構造を有するアニリン樹脂と、プロトン酸硬化促進剤とを含有し、前記プロトン酸硬化促進剤の含有量は、前記エポキシ樹脂100重量部に対して0.01~10.0重量部である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108291009KR1020180092934