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1. (WO2017099183) RESIN COMPOSITION, METHOD FOR PRODUCING RESIN, METHOD FOR PRODUCING RESIN FILM AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/099183 International Application No.: PCT/JP2016/086593
Publication Date: 15.06.2017 International Filing Date: 08.12.2016
IPC:
C08L 79/08 (2006.01) ,C08G 73/10 (2006.01) ,C08K 5/20 (2006.01) ,C08K 5/405 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01) ,H05B 33/10 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
16
Nitrogen-containing compounds
20
Carboxylic acid amides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
36
Sulfur-, selenium-, or tellurium-containing compounds
405
Thioureas; Derivatives thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Applicants:
東レ株式会社 TORAY INDUSTRIES, INC. [JP/JP]; 東京都中央区日本橋室町2丁目1番1号 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038666, JP
Inventors:
宮崎 大地 MIYAZAKI, Daichi; JP
脇田 潤史 WAKITA, Junji; JP
徳田 貴士 TOKUDA, Takashi; JP
立花 康子 TACHIBANA, Yasuko; JP
上岡 耕司 UEOKA, Koji; JP
芦部 友樹 ASHIBE, Tomoki; JP
Agent:
特許業務法人酒井国際特許事務所 SAKAI INTERNATIONAL PATENT OFFICE; 東京都千代田区霞が関3丁目8番1号 虎の門三井ビルディング Toranomon Mitsui Building, 8-1, Kasumigaseki 3-chome, Chiyoda-ku, Tokyo 1000013, JP
Priority Data:
2015-24189911.12.2015JP
2015-24190011.12.2015JP
2016-01860503.02.2016JP
Title (EN) RESIN COMPOSITION, METHOD FOR PRODUCING RESIN, METHOD FOR PRODUCING RESIN FILM AND METHOD FOR PRODUCING ELECTRONIC DEVICE
(FR) COMPOSITION DE RÉSINE, PROCÉDÉ DE PRODUCTION DE RÉSINE, PROCÉDÉ DE PRODUCTION DE FILM DE RÉSINE ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF ÉLECTRONIQUE
(JA) 樹脂組成物、樹脂の製造方法、樹脂膜の製造方法および電子デバイスの製造方法
Abstract:
(EN) The present invention provides an acid resin composition which generates few particles and with which a polyimide film having high mechanical characteristics is obtained after baking. The present invention relates to a resin composition containing (a) a resin having a structure represented by chemical formula (1) and (b) a solvent, wherein the amount of the compound represented by chemical formula (3) is 0.1 mass ppm or more and 40 mass ppm or less.
(FR) La présente invention concerne une composition de résine acide qui génère peu de particules et qui permet d'obtenir, après cuisson, un film de polyimide présentant des caractéristiques mécaniques élevées. La présente invention concerne une composition de résine contenant (a) une résine ayant une structure représentée par la formule chimique (1) et (b) un solvant, la quantité du composé représenté par la formule chimique (3) étant supérieure ou égale à 0,1 ppm en masse et inférieure ou égale à 40 ppm en masse.
(JA) パーティクルの発生が少なく、焼成後に高い機械特性のポリイミド膜が得られる酸樹脂組成物を提供すること。 本発明は、(a)化学式(1)で表される構造を有する樹脂と、(b)溶剤と、を含み、化学式(3)で表される化合物の量が0.1質量ppm以上40質量ppm以下である樹脂組成物である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2017099183IN201847025112KR1020180075688CN108431135US20180362763