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1. (WO2017099145) MICROWAVE MODULE AND HIGH-FREQUENCY MODULE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/099145 International Application No.: PCT/JP2016/086437
Publication Date: 15.06.2017 International Filing Date: 07.12.2016
IPC:
H04B 1/38 (2015.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
1
Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38
Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
垂井 幸宣 TARUI, Yukinobu; JP
木村 実人 KIMURA, Makoto; JP
両川 勇武 RYOKAWA, Isamu; JP
廣田 明道 HIROTA, Akimichi; JP
水谷 浩之 MIZUTANI, Hiroyuki; JP
Agent:
高村 順 TAKAMURA, Jun; JP
Priority Data:
2015-23882107.12.2015JP
PCT/JP2016/06509720.05.2016JP
Title (EN) MICROWAVE MODULE AND HIGH-FREQUENCY MODULE
(FR) MODULE HYPERFRÉQUENCE ET MODULE HAUTE FRÉQUENCE
(JA) マイクロ波モジュール及び高周波モジュール
Abstract:
(EN) This microwave module 1 is provided with an RF device 122 having a metal cover 230 that covers at least an internal circuit, and with a multilayer resin substrate 100 comprising: a first end face 101 which faces the RF device 122; a second end face 102 which is opposite of the first end face 101; multiple signal through-holes 162a which are disposed surrounding the internal circuit and which are connected to the internal circuit; multiple ground through-holes 170 which are disposed surrounding the multiple signal through-holes 162a and which are connected to the metal cover 230; a first surface ground 105 which is disposed on the first end face 101 and which is connected to the metal cover 230; an inner layer surface ground 173 which is connected to multiple ground through-holes 215; and an RF transmission line 132 which is surrounded by the multiple ground through-holes 170, the first surface ground 105 and an inner layer surface ground 173 and which is connected to the multiple signal through-holes 162a.
(FR) L'invention concerne un module hyperfréquence (1) qui comporte un dispositif RF (122) présentant un couvercle métallique (230) qui recouvre au moins un circuit interne, et un substrat en résine multicouche (100) comprenant : une première face d'extrémité (101) qui fait face au dispositif RF (122) ; une seconde face d'extrémité (102) qui est en regard de la première face d'extrémité (101) ; de multiples trous traversants de signal (162a) disposés autour du circuit interne et qui sont connectés au circuit interne ; de multiples trous traversants de masse (170) disposés autour des multiples trous traversants de signal (162a) et qui sont connectés au couvercle métallique (230) ; une première masse de surface (105) qui est disposée sur la première face d'extrémité (101) et connectée au couvercle métallique (230) ; une masse de surface (173) de couche interne qui est connectée à de multiples trous traversants de masse (215) ; et une ligne de transmission RF (132) entourée par les multiples trous traversants de masse (170), la première masse de surface (105) et une masse de surface (173) de couche interne et qui est connectée aux multiples trous traversants de signal (162a).
(JA) マイクロ波モジュール1は、少なくとも内部回路を覆う金属カバー230を有するRFデバイス122と、RFデバイス122側の第1の端面101と、第1の端面101の反対側の第2の端面102と、内部回路を囲んで設けられ内部回路に接続される複数の信号スルーホール162aと、複数の信号スルーホール162aを囲んで設けられ金属カバー230に接続される複数のグランドスルーホール170と、第1の端面101側に設けられ金属カバー230に接続される第1の面グランド105と、複数のグランドスルーホール215に接続される内層面グランド173と、複数のグランドスルーホール170と第1の面グランド105と内層面グランド173とに囲まれ複数の信号スルーホール162aに接続されるRF伝送線路132とを有する多層樹脂基板100と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2017099145AU2016366352EP3389189US20180351595