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1. (WO2017099093) SURFACE-TREATED COPPER FOIL FOR PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE FOR PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/099093 International Application No.: PCT/JP2016/086281
Publication Date: 15.06.2017 International Filing Date: 06.12.2016
IPC:
C25D 7/06 (2006.01) ,B32B 15/04 (2006.01) ,B32B 15/08 (2006.01) ,C25D 5/16 (2006.01) ,C25D 5/48 (2006.01) ,H05K 1/09 (2006.01) ,H05K 3/38 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
06
Wires; Strips; Foils
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
16
Electroplating with layers of varying thickness
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
Applicants:
古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 東京都千代田区丸の内2丁目2番3号 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
齋藤 貴広 SAITO, Takahiro; JP
繪面 健 EZURA, Takeshi; JP
Agent:
飯田 敏三 IIDA, Toshizo; JP
赤羽 修一 AKABA, Shuichi; JP
Priority Data:
2015-24000709.12.2015JP
Title (EN) SURFACE-TREATED COPPER FOIL FOR PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE FOR PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD
(FR) FEUILLE DE CUIVRE TRAITÉE EN SURFACE POUR CARTE DE CIRCUIT IMPRIMÉ, STRATIFIÉ CUIVRÉ POUR CARTE DE CIRCUIT IMPRIMÉ, ET CARTE DE CIRCUIT IMPRIMÉ
(JA) プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
Abstract:
(EN) A surface-treated copper foil that is for a printed circuit board and that has a silane coupling agent layer on a surface on which roughened particles have been formed. The average height of the roughened particles on the silane-coupling-agent-layer surface is 0.05 μm or more but less than 0.5 μm, the BET surface area ratio of the of the silane-coupling-agent-layer surface is 1.2 or higher, and the micro-surface coefficient Cms of the silane-coupling-agent-layer surface is 2.0 or higher but less than 8.0.
(FR) Cette invention concerne une feuille de cuivre traitée en surface pour une carte de circuit imprimé et qui possède une couche d'agent adhésif au silane sur une surface sur laquelle ont été formées des particules rugueuses. La hauteur moyenne des particules rugueuses sur la surface de la couche d'agent adhésif au silane est inférieure ou égale à 0,05 μm mais inférieure à 0,5 μm, le rapport de surface spécifique BET de la surface de la couche d'agent adhésif au silane est supérieur ou égal à 1,2, et le coefficient de micro-surface Cms de la surface de la couche d'agent adhésif au silane est supérieur ou égal à 2,0 mais inférieur à 8,0.
(JA) 粗化粒子が形成された表面にシランカップリング剤層を有するプリント配線板用表面処理銅箔であって、 前記シランカップリング剤層表面において、粗化粒子の平均高さが0.05μm以上0.5μm未満であり、 前記シランカップリング剤層表面のBET表面積比が1.2以上、微細表面係数Cmsが2.0以上8.0未満である、プリント配線板用表面処理銅箔。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN107109679KR1020180037133