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1. (WO2017099041) POLYIMIDE FILM, FLEXIBLE PRINTED BOARD, LED LIGHTING DEVICE ETC.
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/099041 International Application No.: PCT/JP2016/086091
Publication Date: 15.06.2017 International Filing Date: 05.12.2016
IPC:
C08J 5/18 (2006.01) ,C08L 79/08 (2006.01) ,F21V 19/00 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19
Fastening of light sources or lamp holders
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
コニカミノルタ株式会社 KONICA MINOLTA, INC. [JP/JP]; 東京都千代田区丸の内二丁目7番2号 2-7-2, Marunouchi, Chiyoda-ku, Tokyo 1007015, JP
Inventors:
伊香賀 太平 IKOGA, Taihei; JP
伊藤 康敏 ITO, Yasutoshi; JP
Agent:
特許業務法人光陽国際特許事務所 KOYO INTERNATIONAL PATENT FIRM; 東京都千代田区有楽町一丁目1番3号 東京宝塚ビル17階 17F., Tokyo Takarazuka Bldg., 1-1-3, Yurakucho, Chiyoda-ku, Tokyo 1000006, JP
Priority Data:
2015-24173511.12.2015JP
Title (EN) POLYIMIDE FILM, FLEXIBLE PRINTED BOARD, LED LIGHTING DEVICE ETC.
(FR) FILM DE POLYIMIDE, CARTE DE CIRCUIT IMPRIMÉ SOUPLE, DISPOSITIF D'ÉCLAIRAGE À DEL ET AUTRES
(JA) ポリイミドフィルム、フレキシブルプリント基板、LED照明装置等
Abstract:
(EN) The present invention addresses the problem of providing a polyimide film capable of suppressing warping caused by temperature/humidity environment fluctuations when electronic devices are laminated, and of providing a flexible printed board, an LED lighting device, and a flexible display front member that are provided with such polyimide film. The polyimide film of the present invention contains: a polyimide; and an organic compound other than the polyimide, characterized in that the organic compound has a carbonyl group having a number average molecular weight in the range of 300 to 10,000.
(FR) La présente invention vise à proposer un film de polyimide capable de supprimer le gauchissement provoqué par les fluctuations ambiantes de température et d'humidité lorsque des dispositifs électroniques sont stratifiés, et à fournir une carte de circuit imprimé souple, un dispositif d'éclairage à DEL et un élément avant d'affichage souple qui sont pourvus d'un tel film de polyimide. Le film de polyimide selon la présente invention contient un polyimide et un composé organique autre que le polyimide, caractérisé en ce que le composé organique possède un groupe carbonyle ayant une masse moléculaire moyenne en nombre allant de 300 à 10 000.
(JA) 本発明の課題は、電子デバイスと積層したとき温湿度環境変動によるそりの抑制を可能にするポリイミドフィルムを提供することである。また、当該ポリイミドフィルムを備えるフレキシブルプリント基板、LED照明装置及びフレキシブルディスプレイ用前面部材を提供することである。 本発明のポリイミドフィルムは、ポリイミドとポリイミド以外の有機化合物とを含有するポリイミドフィルムであって、前記有機化合物が、数平均分子量が300~10000の範囲内でありカルボニル基を有する有機化合物であることを特徴とする。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)