Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017099019) RADIATION-SENSITIVE RESIN COMPOSITION, CURED FILM, PATTERN FORMATION METHOD, SOLID-STATE IMAGE PICKUP ELEMENT, AND IMAGE DISPLAY IMAGE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/099019 International Application No.: PCT/JP2016/085914
Publication Date: 15.06.2017 International Filing Date: 02.12.2016
IPC:
G03F 7/029 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01) ,G03F 7/031 (2006.01) ,G03F 7/20 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028
with photosensitivity-increasing substances, e.g. photoinitiators
029
Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028
with photosensitivity-increasing substances, e.g. photoinitiators
031
Organic compounds not covered by group G03F7/02967
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
奈良 裕樹 NARA Yuki; JP
青柳 薫 AOYAGI Kaoru; JP
Agent:
特許業務法人特許事務所サイクス SIKS & CO.; 東京都中央区京橋一丁目8番7号 京橋日殖ビル8階 8th Floor, Kyobashi-Nisshoku Bldg., 8-7, Kyobashi 1-chome, Chuo-ku, Tokyo 1040031, JP
Priority Data:
2015-23929408.12.2015JP
Title (EN) RADIATION-SENSITIVE RESIN COMPOSITION, CURED FILM, PATTERN FORMATION METHOD, SOLID-STATE IMAGE PICKUP ELEMENT, AND IMAGE DISPLAY IMAGE
(FR) COMPOSITION DE RÉSINE SENSIBLE À UN RAYONNEMENT, FILM DURCI, PROCÉDÉ DE FORMATION DE MOTIF, ÉLÉMENT DE CAPTURE D'IMAGE À SEMI-CONDUCTEURS ET IMAGE D'AFFICHAGE D'IMAGE
(JA) 感放射線性樹脂組成物、硬化膜、パターン形成方法、固体撮像素子および画像表示装置
Abstract:
(EN) The present invention provides a radiation-sensitive resin composition having excellent sensitivity and exceptional sensitivity stability over time, a cured film, a pattern formation method, a solid-state image pickup element, and an image display image. The radiation-sensitive resin composition contains a resin, a polymerizable compound having ethylenically unsaturated bonds, a photopolymerization initiator, an organic solvent, and water, wherein the photopolymerization initiator contains an oxime ester compound having at least one type of group selected from branched alkyl groups and cyclic alkyl groups, and the water content is 0.1-2% by mass relative to the mass of the radiation-sensitive resin composition.
(FR) La présente invention concerne une composition de résine sensible à un rayonnement ayant une excellente sensibilité et une stabilité de sensibilité exceptionnelle au cours du temps, un film durci, un procédé de formation de motif, un élément de capture d'image à semi-conducteurs et une image d'affichage d'image. La composition de résine sensible à un rayonnement contient une résine, un composé polymérisable ayant des liaisons éthyléniques insaturées, un initiateur de photo-polymérisation, un solvant organique et de l'eau, l'initiateur de photo-polymérisation contenant un composé d'ester d'oxime ayant au moins un type de groupe choisi parmi des groupes alkyle ramifiés et des groupes alkyle cycliques, et la teneur en eau étant de 0,1 à 2 % en masse par rapport à la masse de la composition de résine sensible à un rayonnement.
(JA) 感度が良好で、かつ、感度の経時安定性に優れた感放射線性樹脂組成物、硬化膜、パターン形成方法、固体撮像素子および画像表示装置を提供する。樹脂と、エチレン性不飽和結合を有する重合性化合物と、光重合開始剤と、有機溶剤と、水を含む感放射線性樹脂組成物であって、光重合開始剤は、分岐アルキル基および環状アルキル基から選ばれる少なくとも1種類の基を有するオキシムエステル化合物を含み、水の含有量が、感放射線性樹脂組成物の質量に対して0.1~2質量%である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180077238CN108369377US20180275514