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1. (WO2017098925) OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/098925 International Application No.: PCT/JP2016/084727
Publication Date: 15.06.2017 International Filing Date: 24.11.2016
IPC:
C08G 14/073 (2006.01) ,B32B 15/08 (2006.01) ,C08J 5/24 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
14
Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/-C08G12/168
02
of aldehydes
04
with phenols
06
and monomers containing hydrogen attached to nitrogen
067
Acyclic or carbocyclic monomers
073
Amines
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
DIC株式会社 DIC CORPORATION [JP/JP]; 東京都板橋区坂下三丁目35番58号 35-58, Sakashita 3-chome, Itabashi-ku, Tokyo 1748520, JP
Inventors:
下野智弘 SHIMONO Tomohiro; JP
山口純司 YAMAGUCHI Junji; JP
大津理人 OTSU Masato; JP
有田和郎 ARITA Kazuo; JP
Agent:
河野通洋 KONO Michihiro; JP
Priority Data:
2015-23936208.12.2015JP
2016-15653709.08.2016JP
Title (EN) OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT
(FR) COMPOSÉ OXAZINE, COMPOSITION ET PRODUIT DURCI
(JA) オキサジン化合物、組成物及び硬化物
Abstract:
(EN) An oxazine compound with a specific structure is provided, characterized by having a group that has an aromatic ring structure and multiple specified carbon-carbon triple bond structures. Further, a composition including the oxazine compound having the specific structure of the present invention, a cured product including said composition, and a laminate having a layer of said cured product are provided. Further, a heat resistant material composition characterized by including the composition including the oxazine compound of the present invention, and an electronic material composition are provided.
(FR) L’invention concerne un composé oxazine présentant une structure particulière, caractérisé en ce qu’il comprend un groupe qui a une structure cyclique aromatique et de multiples structures à triple liaison carbone-carbone spécifiées. En outre, l’invention concerne une composition comprenant le composé oxazine ayant la structure particulière selon la présente invention, un produit durci comprenant ladite composition et un stratifié comprenant une couche dudit produit durci. En outre, l’invention concerne une composition de matériau résistant à la chaleur, caractérisée en ce qu’elle comprend la composition comprenant le composé oxazine selon la présente invention, et une composition de matériau électronique.
(JA) 本発明は、芳香環構造と、複数の特定された炭素-炭素間三重結合構造を有する基を有することを特徴とする、特定構造を有するオキサジン化合物を提供する。 また、本発明は、本発明の特定構造を有するオキサジン化合物を含有する組成物、該組成物を含有する硬化物、該硬化物層を有する積層体を提供する。 また、本発明は、本発明のオキサジン化合物を含有する組成物を含有することを特徴とする耐熱材料用組成物、および電子材料用組成物を提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2017098925CN108368217KR1020180092953EP3388459US20180362477