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1. (WO2017098922) RESONATOR DEVICE AND METHOD FOR MANUFACTURING RESONATOR DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/098922 International Application No.: PCT/JP2016/084700
Publication Date: 15.06.2017 International Filing Date: 24.11.2016
IPC:
H01P 1/205 (2006.01) ,H01P 11/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
1
Auxiliary devices
20
Frequency-selective devices, e.g. filters
201
Filters for transverse electromagnetic waves
205
Comb or interdigital filters; Cascaded coaxial cavities
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
11
Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
菊田 誠之 KIKUDA Masayuki; JP
多田 斉 TADA Hitoshi; JP
Agent:
特許業務法人 楓国際特許事務所 KAEDE PATENT ATTORNEYS' OFFICE; 大阪府大阪市中央区農人橋1丁目4番34号 1-4-34, Noninbashi, Chuo-ku, Osaka-shi, Osaka 5400011, JP
Priority Data:
2015-23958108.12.2015JP
Title (EN) RESONATOR DEVICE AND METHOD FOR MANUFACTURING RESONATOR DEVICE
(FR) DISPOSITIF RÉSONATEUR ET PROCÉDÉ DE FABRICATION DE DISPOSITIF RÉSONATEUR
(JA) 共振器装置、および、共振器装置の製造方法
Abstract:
(EN) Provided are a resonator device with which excellent connection reliability is stably obtained, and a method for manufacturing said device. A resonator device (10) is provided with dielectric resonators (1), terminals (3), and a combined substrate (4). The dielectric resonator (1) includes a dielectric block (21) in which a hole (24) is formed, an external conductor (22) formed on the outer surface of the dielectric block (21), and an internal conductor (23) formed on the inner surface of the hole (24). The terminal (3) includes an insertion part (31) inserted into the hole (24) and a projecting part (32) projecting from the hole (24). An upper surface electrode (42) to which the projecting part (32) is soldered is formed on the combined substrate (4). A channel (45) is provided on the joined substrate (4) between the upper surface electrodes (42) and the dielectric resonators (1).
(FR) La présente invention porte sur un dispositif résonateur avec lequel une excellente fiabilité de connexion est obtenue de manière stable, et un procédé de fabrication dudit dispositif. Un dispositif résonateur (10) est pourvu de résonateurs diélectriques (1), de bornes (5) et d'un substrat combiné (4). Le résonateur diélectrique (1) comprend un bloc diélectrique (21) dans lequel est formé un trou (24), un conducteur externe (22) formé sur la surface externe du bloc diélectrique (21), et un conducteur interne (23) formé sur la surface interne du trou (24). La borne (3) comprend une partie d'insertion (31) insérée dans le trou (24) et une partie saillante (32) faisant saillie depuis le trou (24). Une électrode de surface supérieure (42) à laquelle la partie saillante (32) est soudée est formée sur le substrat combiné (4). Un canal (45) est disposé sur le substrat joint (4) entre les électrodes de surface supérieure (42) et les résonateurs diélectriques (1).
(JA) 良好な接続信頼性を安定して得られる共振器装置と、その製造方法とを提供する。 共振器装置(10)は、孔(24)が形成されている誘電体ブロック(21)、誘電体ブロック(21)の外面に形成されている外導体(22)、および孔(24)の内面に形成されている内導体(23)、を含む誘電体共振器(1)と、孔(24)に挿入される挿入部(31)と孔(24)から突出する突出部(32)とを含む端子(3)と、突出部(32)がはんだ付けされる上面電極(42)が形成されている結合基板(4)と、を備え、前記結合基板(4)は、上面電極(42)と誘電体共振器(1)との間に溝(45)を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)