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1. (WO2017098910) HEAT DISSIPATING CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/098910 International Application No.: PCT/JP2016/084469
Publication Date: 15.06.2017 International Filing Date: 21.11.2016
IPC:
H05K 1/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
Applicants:
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
住友電工プリントサーキット株式会社 SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. [JP/JP]; 滋賀県甲賀市水口町ひのきが丘30番地 30, Hinokigaoka, Minakuchi-cho, Koka-shi, Shiga 5280068, JP
Inventors:
齊藤 裕久 SAITO, Hirohisa; JP
元木 健作 MOTOKI, Kensaku; JP
内田 淑文 UCHITA, Yoshifumi; JP
Agent:
中田 元己 NAKATA, Motomi; JP
森田 剛史 MORITA, Takeshi; JP
高城 政浩 TAKAGI, Masahiro; JP
緒方 大介 OGATA, Daisuke; JP
Priority Data:
2015-24056409.12.2015JP
Title (EN) HEAT DISSIPATING CIRCUIT BOARD
(FR) CARTE DE CIRCUIT DE DISSIPATION DE CHALEUR
(JA) 放熱性回路基板
Abstract:
(EN) A heat dissipating circuit board according to one embodiment of the present invention is provided with: a printed wiring board which comprises an insulating sheet and a conductive pattern that is laminated on the front surface of the insulating sheet; and a thermally conductive base which is laminated on the back surface of the insulating sheet of the printed wiring board with a thermally conductive adhesive layer being interposed therebetween. This heat dissipating circuit board has a heat dissipation region which contains at least a part of the projected area of the thermally conductive base, and in which the thickness of the insulating sheet is smaller than that in the other regions.
(FR) La présente invention porte, selon un mode de réalisation, sur une carte de circuit de dissipation de chaleur qui comprend : une carte de circuit imprimé qui comprend une feuille isolante et un motif conducteur qui est stratifié sur la surface avant de la feuille isolante; et une base thermoconductrice qui est stratifiée sur la surface arrière de la feuille isolante de la carte de circuit imprimé, une couche adhésive thermoconductrice étant intercalée entre ces dernières. Cette carte de circuit de dissipation de chaleur comporte une région de dissipation de chaleur qui contient au moins une partie de l'aire projetée de la base thermoconductrice, et dans laquelle l'épaisseur de la feuille isolante est inférieure à celle dans les autres régions.
(JA) 本発明の一態様に係る放熱性回路基板は、絶縁シート及びこの絶縁シートの表面側に積層される導電パターンを有するプリント配線板と、上記プリント配線板の絶縁シートの裏面側に熱伝導性接着剤層を介して積層される熱伝導性基材とを備える放熱性回路基板であって、上記熱伝導性基材の投影領域の少なくとも一部を含み、他の領域よりも絶縁シートの厚さが小さい放熱領域を有する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108370643