Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017098879) EPOXY RESIN, PROCESS FOR PRODUCING EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/098879 International Application No.: PCT/JP2016/084053
Publication Date: 15.06.2017 International Filing Date: 17.11.2016
IPC:
C08G 59/06 (2006.01) ,C07D 303/27 (2006.01) ,C07D 303/28 (2006.01) ,C08J 5/24 (2006.01) ,C08K 3/00 (2006.01) ,C08L 63/02 (2006.01) ,C09J 7/02 (2006.01) ,C09J 163/00 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/46 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
02
Polycondensates containing more than one epoxy group per molecule
04
of polyhydroxy compounds with epihalohydrins or precursors thereof
06
of polyhydric phenols
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
303
Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
02
Compounds containing oxirane rings
12
with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
18
by etherified hydroxyl radicals
20
Ethers with hydroxy compounds containing no oxirane rings
24
with polyhydroxy compounds
27
having all hydroxyl radicals etherified with oxirane containing compounds
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
303
Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
02
Compounds containing oxirane rings
12
with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
18
by etherified hydroxyl radicals
28
Ethers with hydroxy compounds containing oxirane rings
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
02
Polyglycidyl ethers of bis-phenols
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
DIC株式会社 DIC CORPORATION [JP/JP]; 東京都板橋区坂下三丁目35番58号 35-58, Sakashita 3-chome, Itabashi-ku, Tokyo 1748520, JP
Inventors:
広田 陽祐 HIROTA Yousuke; JP
高橋 芳行 TAKAHASHI Yoshiyuki; JP
高橋 歩 TAKAHASHI Ayumi; JP
Agent:
河野 通洋 KONO Michihiro; JP
Priority Data:
2015-23935808.12.2015JP
Title (EN) EPOXY RESIN, PROCESS FOR PRODUCING EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM
(FR) RÉSINE ÉPOXY, PROCÉDÉ DE PRODUCTION DE RÉSINE ÉPOXY, COMPOSITION DE RÉSINE DURCISSABLE, ET OBJET DURCI OBTENU À PARTIR DE CETTE DERNIÈRE
(JA) エポキシ樹脂、エポキシ樹脂の製造方法、硬化性樹脂組成物及びその硬化物
Abstract:
(EN) Provided are: an epoxy resin which has high flowability and, despite this, gives cured objects excellent in terms of heat resistance and moist-heat resistance; a process for producing the epoxy resin; a cured object obtained from the epoxy resin; and uses of the epoxy resin. The epoxy resin is represented by structural formula (1) and has been configured so that in a GPC examination, a peak P appears between peaks corresponding to n=0 and n=1, the peak P having an area which is 0.0100-0.0750 times the area of the peak corresponding to n=0. [G is a glycidyl group; R1 is any of a hydrogen atom, a C1-4 alkyl group, a phenyl group, a hydroxyphenyl group, and a halophenyl group; each symbol * indicates that the group has been bonded to any of the bondable carbon atoms present on the naphthalene ring; and n is the number of repetitions and is 0-10 on average.]
(FR) La présente invention concerne : une résine époxy présentant une fluidité élevée et, malgré cela, permettant d'obtenir des objets durcis excellents en termes de résistance à la chaleur et de résistance à la chaleur humide ; un procédé de production de la résine époxy ; un objet durci obtenu à partir de la résine époxy ; et les utilisations de la résine époxy. La résine époxy est représentée par la formule structurelle (1) et a été configurée de sorte que dans une analyse par CPG, un pic P apparaisse entre les pics correspondant à n = 0 et n = 1, le pic P ayant une surface qui est 0,0100 à 0,0750 fois la surface du pic correspondant à n = 0. [G est un groupe glycidyle ; R1 est n’importe lequel parmi un atome d’hydrogène, un groupe alkyle en C1-4, un groupe phényle, un groupe hydroxyphényle, et un groupe halophényle ; chaque symbole * indique que le groupe a été lié à n’importe lequel des atomes de carbone pouvant être liés présents sur le cycle naphtalène ; et n est le nombre de répétitions et est en moyenne de 0 à 10.]
(JA) 高い流動性を有しながら、得られる硬化物が耐熱性と耐湿熱性に優れるエポキシ樹脂、エポキシ樹脂の製造方法、その硬化物及び用途を提供すること。 下記構造式(1)で表されるエポキシ樹脂であって、GPC測定においてn=0とn=1の間に現れるピークPのピーク面積がn=0のピーク面積に対し、0.0100倍以上、0.0750倍以下であるように構成した。 [Gはグリシジル基、Rは、水素原子、炭素数が1~4のアルキル基、フェニル基、ヒドロキシフェニル基、ハロゲン置換フェニル基のいずれか、*はナフタレン環上の結合可能な何れかの炭素原子に結合していることを示し、nは繰り返し数で、平均値0~10]
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2017098879CN108368237KR1020180090264US20180346639