Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017098621) ELECTRONIC COMPONENT UNIT AND HEAT CONDUCTIVE PLACEMENT MEMBER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/098621 International Application No.: PCT/JP2015/084595
Publication Date: 15.06.2017 International Filing Date: 10.12.2015
Chapter 2 Demand Filed: 14.04.2016
IPC:
H05K 7/20 (2006.01) ,H01L 23/36 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
新電元工業株式会社 SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. [JP/JP]; 東京都千代田区大手町二丁目2番1号 2-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
池田 康亮 IKEDA, Kosuke; JP
松嵜 理 MATSUZAKI, Osamu; JP
Agent:
大野 聖二 OHNO, Seiji; JP
Priority Data:
Title (EN) ELECTRONIC COMPONENT UNIT AND HEAT CONDUCTIVE PLACEMENT MEMBER
(FR) UNITÉ DE COMPOSANT ÉLECTRONIQUE ET ÉLÉMENT DE POSITIONNEMENT CONDUCTEUR DE LA CHALEUR
(JA) 電子部品ユニット及び熱伝導載置部材
Abstract:
(EN) An electronic component unit of the present invention has: a heat sink (300); a first electronic component (100), which is provided upright with respect to the heat sink (300), and extending in the first direction; and a heat conductive placement member (10) for conducting, to the heat sink (300), heat generated from the first electronic component (100). The heat conductive placement member (10) has: a contact section (20) in contact with the heat sink (300); a first extending section (31) extending in the first direction from the contact section (20); and a second extending section (32), which is disposed to face the first extending section (31), and extending in the first direction from the contact section (20). The first electronic component (100) is sandwiched between the first extending section (31) and the second extending section.
(FR) La présente invention concerne une unité de composant électronique comprenant: un dissipateur thermique (300); un premier composant électronique (100), qui est placé verticalement par rapport au dissipateur thermique (300), et s'étendant dans la première direction; et un élément (10) de positionnement conducteur de la chaleur servant à conduire, vers le dissipateur thermique (300), de la chaleur générée à partir du premier composant électronique (100). L'élément (10) de positionnement conducteur de la chaleur comprend: une section (20) de contact en contact avec le dissipateur thermique (300); un première section (31) de prolongement s'étendant dans la première direction à partir de la section (20) de contact; et une deuxième section (32) de prolongement, qui est disposée de manière à faire face à la première section (31) de prolongement, et qui s'étend dans la première direction à partir de la section (20) de contact. Le premier composant électronique (100) est pris en sandwich entre la première section (31) de prolongement et la deuxième section de prolongement.
(JA) 電子部品ユニットは、ヒートシンク(300)と、ヒートシンク(300)に対して立設し、第1方向に延びた第一電子部品(100)と、第一電子部品(100)から発生する熱をヒートシンク(300)に伝導するための熱伝導載置部材(10)と、を有している。熱伝導載置部材(10)は、ヒートシンク(300)に当接する当接部(20)と、当接部(20)から第1方向に延びた第一延在部(31)と、第一延在部(31)に対向して配置され、当接部(20)から第1方向に延びた第二延在部(32)と、を有している。第一電子部品(100)は第一延在部(31)と前二延在部との間で挟持されている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2017098621