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1. (WO2017098593) POWER MODULE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/098593 International Application No.: PCT/JP2015/084479
Publication Date: 15.06.2017 International Filing Date: 09.12.2015
IPC:
H01L 23/28 (2006.01) ,H01L 23/36 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
酒井 康裕 SAKAI Yasuhiro; JP
Agent:
吉竹 英俊 YOSHITAKE Hidetoshi; JP
Priority Data:
Title (EN) POWER MODULE
(FR) MODULE DE PUISSANCE
(JA) パワーモジュール
Abstract:
(EN) The technology disclosed in the present description relates to a power module capable of reducing stress (heat stress) that can be generated in a product, while improving productivity of the product. A power module relating to the present technology is provided with: a heat dissipating plate 10A; an insulating substrate 12 positioned on an upper surface of the heat dissipating plate 10A; a semiconductor element 14 positioned on an upper surface of the insulating substrate 12; a case 15, which is disposed to surround the insulating substrate 12 in plan view, and which is positioned on the upper surface of the heat dissipating plate 10A; and a rubber-based material 20A sandwiched between the heat dissipating plate 10A and the case 15. The heat dissipating plate 10A and/or the case 15 has a surface having a recessed and protruding shape, said surface being in contact with the rubber-based material 20A.
(FR) La technologie décrite dans la présente invention concerne un module de puissance pouvant réduire la contrainte (contrainte thermique) qui peut être générée dans un produit, tout en améliorant la productivité du produit. Un module de puissance selon la présente invention est pourvu : d'une plaque de dissipation thermique 10A ; d'un substrat isolant 12 positionné sur une surface supérieure de la plaque de dissipation thermique 10A ; d'un élément à semi-conducteur 14 positionné sur une surface supérieure du substrat isolant 12 ; d'un boîtier 15, qui est disposé de manière à entourer le substrat isolant 12 en vue plane, et qui est positionné sur la surface supérieure de la plaque de dissipation thermique 10A ; et d'un matériau à base de caoutchouc 20A pris en sandwich entre la plaque de dissipation thermique 10A et le boîtier 15. La plaque de dissipation thermique 10A et/ou le boîtier 15 présentent une surface ayant une forme renfoncée et saillante, ladite surface étant en contact avec le matériau à base de caoutchouc 20A.
(JA) 本明細書に開示される技術は、製品の生産性を向上させつつ、製品に生じ得るストレス(熱応力)を軽減させることができるパワーモジュールに関するものである。本技術に関するパワーモジュールは、放熱板10Aと、放熱板10Aの上面に位置する絶縁基板12と、絶縁基板12の上面に位置する半導体素子14と、絶縁基板12を平面視において囲んで配置され、かつ、放熱板10Aの上面に位置するケース15と、放熱板10Aとケース15とに挟まれるゴム系材料20Aとを備え、放熱板10Aおよびケース15のうちの少なくとも一方は、ゴム系材料20Aと接触する面が凸凹形状である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)