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1. (WO2017098292) SYSTEM CONFIGURED FOR SPUTTER DEPOSITION ON A SUBSTRATE, SHIELDING DEVICE FOR A SPUTTER DEPOSITION CHAMBER, AND METHOD FOR PROVIDING AN ELECTRICAL SHIELDING IN A SPUTTER DEPOSITION CHAMBER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/098292 International Application No.: PCT/IB2015/002317
Publication Date: 15.06.2017 International Filing Date: 09.12.2015
IPC:
C23C 14/34 (2006.01) ,C23C 14/54 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
54
Controlling or regulating the coating process
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, CA 95054, US
ZILBAUER, Thomas Werner [DE/DE]; DE (US)
HENKEL, Uwe [DE/DE]; DE (US)
THIEL, Johannes [DE/DE]; DE (US)
EL ZAAR, Kamal [DE/DE]; DE (US)
KELLER, Stefan [DE/DE]; DE (US)
Inventors:
ZILBAUER, Thomas Werner; DE
HENKEL, Uwe; DE
THIEL, Johannes; DE
EL ZAAR, Kamal; DE
KELLER, Stefan; DE
Agent:
ZIMMERMANN & PARTNER PATENTANWÄLTE MBB; Josephspitalstr. 15 80331 München, DE
Priority Data:
Title (EN) SYSTEM CONFIGURED FOR SPUTTER DEPOSITION ON A SUBSTRATE, SHIELDING DEVICE FOR A SPUTTER DEPOSITION CHAMBER, AND METHOD FOR PROVIDING AN ELECTRICAL SHIELDING IN A SPUTTER DEPOSITION CHAMBER
(FR) SYSTÈME CONFIGURÉ POUR LE DÉPÔT PAR PULVÉRISATION SUR UN SUBSTRAT, DISPOSITIF DE BLINDAGE POUR UNE CHAMBRE DE DÉPÔT PAR PULVÉRISATION ET PROCÉDÉ POUR RÉALISER UN BLINDAGE ÉLECTRIQUE DANS UNE CHAMBRE DE DÉPÔT PAR PULVÉRISATION
Abstract:
(EN) The present disclosure provides a system (100) configured for sputter deposition on a substrate (10). The system (100) includes a sputter deposition chamber (110) having a processing zone (112), one or more sputter deposition sources (120) arranged at a first side of the processing zone (112), and a shielding device (130) arranged at a second side of the processing zone (112), wherein the shielding device (130) includes a frame assembly (132) mounted to the sputter deposition chamber (110) and one or more conductive sheets (134) detachably mounted on the frame assembly (132), wherein the one or more conductive sheets (134) provide a surface (136) arranged along the processing zone (112).
(FR) La présente invention concerne un système (100) conçu pour effectuer un dépôt par pulvérisation sur un substrat (10). Le système (100) comprend une chambre (110) de dépôt par pulvérisation présentant une zone de traitement (112), une ou plusieurs sources de dépôt par pulvérisation (120) disposée(s) sur un premier côté de la zone de traitement (112) et un dispositif de blindage (130) disposé sur un deuxième côté de la zone de traitement (112), le dispositif de blindage (130) comprenant un ensemble cadre (132) monté sur la chambre (110) de dépôt par pulvérisation et une ou plusieurs feuilles conductrices (134) montées de manière amovible sur l'ensemble cadre (132), ladite une ou lesdites plusieurs feuilles conductrices (134) fournissent une surface (136) disposée le long de la zone de traitement (112).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
CN108291293KR1020180086217EP3387162US20180358212