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1. (WO2017096945) ORGANIC SILICON COMPOUND CONTAINING BORON, SEALANT FOR SOLAR CELL ASSEMBLY AND SOLAR CELL ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/096945 International Application No.: PCT/CN2016/095850
Publication Date: 15.06.2017 International Filing Date: 18.08.2016
IPC:
C07F 7/08 (2006.01) ,C09J 11/06 (2006.01) ,C09J 183/05 (2006.01) ,C09J 183/07 (2006.01) ,C08L 83/05 (2006.01) ,C08L 83/07 (2006.01) ,C08K 5/5419 (2006.01) ,C08K 5/55 (2006.01)
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
F
ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
7
Compounds containing elements of the 4th Group of the Periodic System
02
Silicon compounds
08
Compounds having one or more C-Si linkages
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
541
containing oxygen
5415
containing at least one Si-O bond
5419
containing at least one Si-C bond
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
55
Boron-containing compounds
Applicants:
北京康美特科技股份有限公司 BEIJING KMT TECHNOLOGY CO., LTD. [CN/CN]; 中国北京市 海淀区上地开拓路5号三层A-308室 A308, 3F, No.5 Kaituo Road, Shangdi, Haidian District Beijing 100085, CN
Inventors:
李振忠 LI, Zhenzhong; CN
马静 MA, Jing; CN
邓祚主 DENG, Zuozhu; CN
Agent:
北京林达刘知识产权代理事务所(普通合伙) LINDA LIU & PARTNERS; 中国北京市 东城区北三环东路36号北京环球贸易中心C座16层 F16 Tower C, Beijing Global Trade Center, 36 North Third Ring East Road Dongcheng District, Beijing 100013, CN
Priority Data:
201510888485.707.12.2015CN
201510892174.807.12.2015CN
Title (EN) ORGANIC SILICON COMPOUND CONTAINING BORON, SEALANT FOR SOLAR CELL ASSEMBLY AND SOLAR CELL ASSEMBLY
(FR) COMPOSÉ DE SILICIUM ORGANIQUE CONTENANT DU BORE, MATÉRIAU D’ÉTANCHÉITÉ POUR ENSEMBLE CELLULE SOLAIRE ET ENSEMBLE CELLULE SOLAIRE
(ZH) 含硼有机硅化合物、太阳能电池组件用密封剂以及太阳能电池组件
Abstract:
(EN) Provided are an organic silicon compound containing boron, a sealant for a solar cell assembly and a solar cell assembly. The molecular skeleton of the organic silicon compound containing boron is composed of a cycloalkenyl, a silicon-oxygen bond (Si-O) and a cycloalkyl, and contains three boracic acid or borate groups bonded via a cycloalkyl. The organic silicon compound containing boron is used as a tackifier for an addition-curable organopolysiloxane composition, and can provide a sufficient and long-term stable adhesiveness for a cured product thereof in a high-temperature and high-humidity and ultraviolet light environment. In addition, an organic silicon compound containing boron with a controllable chemical structure, substantially without byproducts, and a stable quality and performance can be obtained by preparing the organic silicon compound containing boron through a hydrosilation reaction.
(FR) La présente invention concerne un composé de silicium organique contenant du bore, un matériau d’étanchéité pour ensemble cellule solaire et un ensemble cellule solaire. Le squelette moléculaire du composé de silicium organique contenant du bore est composé d’un groupe cycloalcényle, d’une liaison silicium-oxygène (Si-O) et d’un cycloalkyle, et contient trois groupes acide boracique ou borate liés par l'intermédiaire d'un groupe cycloalkyle. Le composé de silicium organique contenant du bore est utilisé comme agent poisseux pour une composition d’organopolysiloxane durcissable par addition, et peut fournir une adhésivité stable à long terme et suffisante pour un produit durci à partir de cette dernière dans un environnement de haute température et d'humidité élevée et de lumière ultraviolette. De plus, un composé de silicium organique contenant du bore présentant une structure chimique réglable, sensiblement sans sous-produits, et une qualité et une performance stables peut être obtenu par la préparation du composé de silicium organique contenant du bore au moyen d'une réaction d’hydrosilylation.
(ZH) 提供了含硼有机硅化合物、太阳能电池组件用密封剂以及太阳能电池组件。所述的含硼有机硅化合物其分子骨架由环烯基、硅氧键(Si-O)和环烷基构成,并含有三个介由环烷基进行键合的硼酸或硼酸酯基团。所述的含硼有机硅化合物用作加成固化型有机聚硅氧烷组合物的增粘剂,能够在高温高湿和紫外线环境中为其固化物提供充分且长期稳定的粘合性。此外,通过硅氢化反应制备含硼有机硅化合物,能够获得化学结构可控,基本上没有副产物,品质和性能稳定的含硼有机硅化合物。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)