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1. (WO2017096811) PCB DEVICE CAPABLE OF EXPANDING FUNCTION, MODULE BOARD AND METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/096811 International Application No.: PCT/CN2016/088580
Publication Date: 15.06.2017 International Filing Date: 05.07.2016
IPC:
H05K 1/18 (2006.01) ,H05K 3/40 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
Applicants:
乐视控股(北京)有限公司 LE HOLDINGS (BEIJING) CO., LTD. [CN/CN]; 中国北京市 朝阳区姚家园路105号3号楼10层1102 Room 1102, 10 Layer, Building 3, 105 Yaojiayuan Road, Chaoyang District Beijing 100025, CN
乐视致新电子科技(天津)有限公司 LE SHI ZHI XIN ELECTRONIC TECHNOLOGY (TIANJIN) LIMITED [CN/CN]; 中国天津市 滨海新区生态城动漫中路126号动漫大厦B1区二层201-427 201-427 2nd Floor, B1 Dongman Building, NO.126 Dongman Middle Road, Eco-city, Binhai New Area Tianjin 300467, CN
Inventors:
侯晓明 HOU, Xiaoming; CN
Agent:
北京合智同创知识产权代理有限公司 BEIJING HEADSTAY INTELLECTUAL PROPERTY INC.; 中国北京市 海淀区大钟寺13号院1号楼华杰大厦5A1-2 Room 5A1-2, Huajie Plaza, Building No.1, Dazhongsi No.13, Haidian District Beijing 100098, CN
Priority Data:
201510919338.109.12.2015CN
Title (EN) PCB DEVICE CAPABLE OF EXPANDING FUNCTION, MODULE BOARD AND METHOD
(FR) DISPOSITIF DE PCB CAPABLE DE FONCTION D'EXTENSION, CARTE DE MODULE ET PROCÉDÉ
(ZH) 一种可进行功能扩展的PCB装置,模块板及方法
Abstract:
(EN) Provided are a PCB device capable of expanding a function, module board and method. The PCB device comprises: a substrate (11) comprising a PCB design thereon; at least one module board (12) comprising an integrated performance enhancement module thereon; and a connector (13), wherein the module board (12) is connected to the substrate (11) via the connector (13), so as to enable the module board (12) and the substrate (11) to perform a signal transmission. The present invention expands the function of the PCB design and reduces workloads for design and development and risks for purchasing a unused stock, leading to more flexible design and development.
(FR) La présente invention porte sur un dispositif de carte de circuits imprimés (PCB) capable de fonction d'extension, un carte de module et un procédé. Le dispositif PCB comprenant : un substrat (11) comprenant une conception PCB sur ce dernier; au moins une carte de module (12) comprenant un module d'amélioration de performances intégré sur cette dernière; et un connecteur (13), la carte de module (12) étant connectée au substrat (11) par l'intermédiaire du connecteur (13), de façon à permettre à la carte de module (12) et au substrat (11) d'effectuer une transmission de signal. La présente invention étend la fonction de la conception PCB et réduit les charges de travail pour la conception et le développement et les risques d'achat d'un stock inutilisé, conduisant à la conception et au développement plus souples.
(ZH) 提供一种可进行功能扩展的PCB装置,模块板及方法,该PCB装置包括进行PCB设计的基板(11),还包括:至少一模块板(12),模块板(12)上集成性能提升模块;连接器(13),该模块板(12)通过该连接器(13)连接该基板(11),令该模块板(12)和该基板(11)进行信号传输。由此对PCB设计进行功能扩展,减少了设计开发的工作量和采购呆料的风险,令设计开发更加灵活。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)