Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017096696) ORGANIC LIGHT EMITTING DIODE PACKAGING STRUCTURE AND METHOD, AND ORGANIC LIGHT EMITTING DIODE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/096696 International Application No.: PCT/CN2016/071543
Publication Date: 15.06.2017 International Filing Date: 21.01.2016
IPC:
H01L 51/50 (2006.01) ,H01L 51/52 (2006.01) ,H01L 51/56 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants:
深圳市华星光电技术有限公司 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国广东省深圳市 光明新区塘明大道9-2号 No. 9-2 Tangming Road, Guangming Shenzhen, Guangdong 518132, CN
Inventors:
陈黎暄 CHEN, Lixuan; CN
Agent:
深圳市铭粤知识产权代理有限公司 MING & YUE INTELLECTUAL PROPERTY LAW FIRM; 中国广东省深圳市南山区南山街道前海路泛海城市广场2栋604室 Room 604 Building 2, Oceanwide City Square, Qianhai Road, Nanshan Street, Nanshan District Shenzhen, Guangdong 518066, CN
Priority Data:
201510900239.909.12.2015CN
Title (EN) ORGANIC LIGHT EMITTING DIODE PACKAGING STRUCTURE AND METHOD, AND ORGANIC LIGHT EMITTING DIODE
(FR) STRUCTURE ET PROCÉDÉ DE CONDITIONNEMENT DE DIODE ÉLECTROLUMINESCENTE ORGANIQUE, ET DIODE ÉLECTROLUMINESCENTE ORGANIQUE
(ZH) 有机发光二极管封装结构、封装方法及有机发光二极管
Abstract:
(EN) An organic light emitting diode packaging method, an organic light emitting diode packaging structure (20), and an organic light emitting diode (100) having the organic light emitting diode packaging structure (20). The organic light emitting diode packaging structure (20) comprises: a first packaging film layer (21), a second packaging film layer (22) on the surface of a side of the first package film layer (21), and scattering particles (23) formed between the first packaging film layer (21) and the second packaging film layer (22) and used for forming scattered incident light. For the organic light emitting diode packaging method, the organic light emitting diode packaging structure (20), and the organic light emitting diode (100), the scattering particles (23) are formed in a cathode packaging film layer and able to implement a scattering function on ambient light and stray light, so as to reduce reflection of light caused by a cathode (10), so that the clarity and contrast ratio of the organic light emitting diode (100) can be improved.
(FR) L'invention concerne un procédé de conditionnement de diode électroluminescente organique, une structure (20) de conditionnement de diode électroluminescente organique, et une diode électroluminescente organique (100) dotée de la structure (20) de conditionnement de diode électroluminescente organique. La structure (20) de conditionnement de diode électroluminescente organique comporte: une première couche (21) de film de conditionnement, une deuxième couche (22) de film de conditionnement sur la surface d'un côté de la première couche (21) de film de conditionnement, et des particules (23) de diffusion formées entre la première couche (21) de film de conditionnement et la deuxième couche (22) de film de conditionnement et utilisées pour former une lumière incidente diffusée. Pour le procédé de conditionnement de diode électroluminescente organique, la structure (20) de conditionnement de diode électroluminescente organique, et la diode électroluminescente organique (100), les particules (23) de diffusion sont formées dans une couche de film de conditionnement de cathode et capables de réaliser une fonction de diffusion sur une lumière ambiante et une lumière parasite, de façon à réduire la réflexion de la lumière causée par une cathode (10), de sorte que la netteté et le rapport de contraste de la diode électroluminescente organique (100) peuvent être améliorés.
(ZH) 一种有机发光二极管封装方法、有机发光二极管封装结构(20)及具有所述发光二极管封装结构(20)的有机发光二极管(100)。所述有机发光二极管封装结构(20)包括:第一封装膜层(21)、位于所述第一封装膜层(21)一侧表面的第二封装膜层(22),以及形成于所述第一封装膜层(21)以及所述第二封装膜层(22)之间的散射粒子(23),所述散射粒子(23)用于对入射光形成散射。所述有机发光二极管封装方法、有机发光二极管封装结构(20)及发光二极管(100)在阴极封装膜层内形成所述散射粒子(23),所述散射粒子(23)可以对环境光或者杂散光形成散射作用,以降低阴极(10)对光线的反射,因此能够提高有机发光二极管(100)的对比度的清晰度。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)
Also published as:
US20180034004