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1. (WO2017096028) RAPID PCB PROTOTYPING BY SELECTIVE ADHESION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/096028 International Application No.: PCT/US2016/064398
Publication Date: 08.06.2017 International Filing Date: 01.12.2016
IPC:
H05K 1/03 (2006.01) ,H05K 1/02 (2006.01) ,H05K 3/10 (2006.01) ,H05K 3/38 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
Applicants:
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC [US/US]; 14520 Botts Road Kansas City, Missouri 64147, US
Inventors:
HATCH, Jonathan Douglas; US
HATCH, Stephen McGarry; US
Agent:
LUEBBERING, Thomas B.; US
Priority Data:
14/957,42602.12.2015US
Title (EN) RAPID PCB PROTOTYPING BY SELECTIVE ADHESION
(FR) PROTOTYPAGE DE PCB RAPIDE PAR ADHÉRENCE SÉLECTIVE
Abstract:
(EN) A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.
(FR) Selon la présente invention, une page vierge de carte de circuit imprimé (PCB) comprend un substrat souple, un adhésif durcissable, une couche conductrice et un support de couche conductrice. Un motif de circuit négatif opaque est déposé sur le substrat souple. Des parties de l'adhésif durcissable non masquées par le motif de circuit peuvent se coller à des parties de la couche conductrice lorsqu'elles sont exposées à un rayonnement lumineux. Les parties collées de la couche conductrice se cisaillent ou se déchirent au niveau de parties non collées de la couche conductrice de telle sorte que les parties collées restent avec le substrat souple et les parties non collées restent avec le support de couche conductrice lorsque le substrat souple et le support de couche conductrice sont séparés. Le substrat souple et les parties collées de la couche conductrice forment ainsi un prototype de PCB, les parties collées de la couche conductrice formant des pistes de circuit du motif de circuit.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)