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1. (WO2017095712) LED METAL PAD CONFIGURATION FOR OPTIMIZED THERMAL RESISTANCE, SOLDER RELIABILITY, AND SMT PROCESSING YIELDS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/095712 International Application No.: PCT/US2016/063673
Publication Date: 08.06.2017 International Filing Date: 23.11.2016
IPC:
H01L 33/64 (2010.01) ,H01L 23/34 (2006.01) ,H01L 23/36 (2006.01) ,H01L 23/433 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
64
Heat extraction or cooling elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
42
Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
433
Auxiliary members characterised by their shape, e.g. pistons
Applicants:
LUMILEDS HOLDING B.V. [NL/NL]; The Base, Tower B5 unit 107 Evert van de Beekstraat 1 1118 CL Schiphol, NL
Inventors:
MEHNERT, Axel; US
Agent:
KERNER, Dawn C.; US
Priority Data:
16160384.015.03.2016EP
62/262,31102.12.2015US
Title (EN) LED METAL PAD CONFIGURATION FOR OPTIMIZED THERMAL RESISTANCE, SOLDER RELIABILITY, AND SMT PROCESSING YIELDS
(FR) CONFIGURATION DE PLOT MÉTALLIQUE À DIODES ÉLECTROLUMINESCENTES POUR RÉSISTANCE THERMIQUE, FIABILITÉ DE BRASURE, ET RENDEMENTS DE TRAITEMENT DE MONTAGE EN SURFACE OPTIMISÉS
Abstract:
(EN) Cathode and anode electrodes are located on the bottom surface of an LED submount along a center line of the bottom surface. Two thermal pads are located on either side of the electrodes along opposite sides of the bottom surface. This configuration results in less stress on solder bonding the electrodes to a circuit board. Further, since the heat conducted by the two thermal pads is not choked by the electrodes, the heat spreads more uniformly into the circuit board. Further, since the metal design is symmetrical in that the outer thermal pads are identical, the molten solder will have the same shape over both thermal pads, causing the LED die and submount to be not tilted with respect to the surface of the circuit board. Other configurations are described that also improve the thermal and electrical characteristics of the LED die.
(FR) Des électrodes cathode et anode sont situées sur la surface inférieure d'une embase de diodes électroluminescentes le long d'une ligne centrale de la surface inférieure. Deux plots thermiques sont situés de part et d'autre des électrodes le long de côtés opposés de la surface inférieure. Cette configuration réduit la contrainte sur la brasure soudant les électrodes sur une carte de circuit imprimé. En outre, étant donné que la chaleur conduite par les deux plots thermiques n'est pas restreinte par les électrodes, la chaleur se diffuse plus uniformément dans la carte de circuit. Par ailleurs, étant donné que la construction métallique est symétrique en ce que les plots thermiques extérieurs sont identiques, la brasure fondue présente la même forme sur les deux plots thermiques, interdisant l'inclinaison de la puce DEL et de l'embase par rapport à la surface de la carte de circuit imprimé. L'invention concerne d'autres configurations qui améliorent également les caractéristiques thermiques et électriques de la puce DEL.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP3384539KR1020180111786US20180358527CN109314170