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1. (WO2017095419) A HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/095419 International Application No.: PCT/US2015/063761
Publication Date: 08.06.2017 International Filing Date: 03.12.2015
IPC:
H05K 1/18 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
STARKSTON, Robert; US
STAMEY, Richard C.; US
SANKMAN, Robert L.; US
MOKLER, Scott M.; US
Agent:
WINKLE, Robert G.; US
Priority Data:
Title (EN) A HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME
(FR) SUBSTRAT MICROÉLECTRONIQUE HYBRIDE ET SES PROCÉDÉS DE FABRICATION
Abstract:
(EN) A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.
(FR) Un substrat microélectronique hybride peut être formé par l'incorporation d'un substrat de pièce microélectronique de haute densité à l'intérieur d'un substrat microélectronique de densité inférieure. Le substrat microélectronique hybride peut permettre une fixation directe de puces à bosse d'un dispositif microélectronique ayant des interconnexions de haute densité à la partie substrat de pièce microélectronique de haute densité du substrat microélectronique hybride, tout en permettant une interconnexion de densité inférieure et des chemins électriques dans des zones où les interconnexions de haute densité ne sont pas nécessaires.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20180343744