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1. (WO2017095396) MINIATURE ULTRASONIC TRANSDUCER PACKAGE
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CLAIMS

What is claimed is:

1 . A micromachined ultrasound transducer (MUT) package, comprising:

a cavity characterized by a curved geometry; and

a MUT mounted to a side of a substrate facing the cavity with a sound emitting portion of the MUT facing an aperture in the substrate, wherein the substrate is disposed over an opening of the cavity with the substrate oriented such that the MUT is located within the cavity.

2. The apparatus of claim 1 , wherein the cavity is characterized by a cylindrical geometry.

3. The apparatus of claim 2, wherein the cavity is characterized by a circular cylindrical geometry.

4. The apparatus of claim 3, wherein the cavity is characterized by a circular cylindrical geometry characterized by a cylinder radius of between 0.2 mm and 5 mm.

5. The apparatus of claim 4, wherein the cylinder radius is between 0.3 mm and 2.5 mm.

6. The apparatus of claim 5, wherein the MUT is configured to operate at a

frequency between 100 kHz and 600 kHz.

7. The apparatus of claim 4, wherein the cylindrical geometry is further

characterized by a cylinder height in a range from 0.1 mm to 2 mm.

8. The apparatus of claim 4, wherein the cylinder height is in a range from 0.4 mm to 1 mm.

9. The apparatus of claim 3, wherein a radius and height of the cavity are

configured such that acoustic resonance modes of the cavity do not interfere with the pMUT's operating frequency

10. The apparatus of claim 2, wherein the MUT is centered with respect to a cylindrical symmetry axis of the cavity.

1 1 .The apparatus of claim 2, wherein the substrate is a top substrate and the

cavity is formed by a spacer sandwiched between the top substrate and a bottom substrate, the spacer having a cylindrical opening formed therethrough.

12. The apparatus of claim 1 1 , wherein the MUT is mounted to a top substrate to completely cover an aperture in the top substrate.

13. The apparatus of claim 12, wherein an application specific integrated circuit (ASIC) is mounted to a bottom substrate and a plurality of electrical

connections are made to the ASIC through the bottom substrate.

14. The apparatus of claim 2, wherein the substrate is a bottom substrate and the cavity is formed by a lid having a cylindrical cavity.

15. The apparatus of claim 14, wherein the MUT is mounted to the bottom

substrate to completely cover an aperture in the substrate.

16. The apparatus of claim 15, wherein an application specific integrated circuit (ASIC) is mounted alongside the MUT on a bottom substrate.

17. The apparatus of claim 14, wherein the MUT is mounted inside the lid to

completely cover an aperture in the lid.

18. The apparatus of claim 17, wherein an application specific integrated circuit (ASIC) is mounted to a bottom substrate and a plurality of electrical

connections are made to the ASIC through the bottom substrate.

19. The apparatus of claim 1 , wherein the cavity is characterized by a

hemispherical geometry.

20. The apparatus of claim 19, wherein the MUT is centered with respect to a

hemispherical symmetry axis of the cavity.

21 . The apparatus of claim 19, wherein the hemispherical geometry is characterized by a hemispherical radius between 0.2 mm and 3 mm.

22. The apparatus of claim 19, wherein the hemispherical radius is between 0.3 mm and 2 mm.

23. The apparatus of claim 19, wherein the MUT is configured to operate at a frequency between 100 kHz and 600 kHz.

24. The apparatus of claim 1 , wherein the sound emitting portion of the MUT includes a membrane disposed over an opening in a MUT substrate.

25. The apparatus of claim 1 , wherein the MUT is a piezoelectric micromachined ultrasound transducer (pMUT).

26. The apparatus of claim 1 , wherein the MUT is a capacitive micromachined ultrasonic transducer (cMUT).