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1. (WO2017095332) METHOD OF MANUFACTURING A LAMINATED SUBSTRATE FOR SMART CARDS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/095332 International Application No.: PCT/SG2016/050586
Publication Date: 08.06.2017 International Filing Date: 30.11.2016
IPC:
G06K 19/077 (2006.01) ,B32B 37/12 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
12
characterised by using adhesives
Applicants:
LINXENS HOLDING [FR/FR]; Immeuble Crystal, 6 Rue Hélène Boucher, 78280 Guyancourt, FR
LINXENS SINGAPORE PTE LTD [SG/SG]; 22 Changi North Way, Singapore 498810, SG
Inventors:
GUILLEMAIN, Roland; FR
YEAP, Yean Wei; SG
Agent:
ALLEN & GLEDHILL LLP; One Marina Boulevard #28-00 Singapore 018989, SG
Priority Data:
62/260,90130.11.2015US
Title (EN) METHOD OF MANUFACTURING A LAMINATED SUBSTRATE FOR SMART CARDS
(FR) PROCÉDÉ DE FABRICATION D’UN SUBSTRAT STRATIFIÉ POUR DES CARTES INTELLIGENTES
Abstract:
(EN) This invention relates to a method of manufacturing a laminated substrate for smart cards with simplified and fewer process steps compared to conventional methods. The method comprises the preparation of an electrically conductive layer by stamping to form a contact pattern and reference holes followed by plating of a contact side of the layer. A dielectric layer is separately prepared by coating its top side with an adhesive. A bonding side of the plated conductive layer then is affixed to the adhesive coated side of the dielectric layer in a lamination step, followed by subsequent curing of the adhesive. Finally, the dielectric layer is drilled to form bonding holes for electrical connections with the electrically conductive layer.
(FR) La présente invention concerne un procédé de fabrication d’un substrat stratifié pour des cartes intelligentes présentant des étapes de traitement simplifiées et moins nombreuses par comparaison avec des procédés classiques. Le procédé comprend la préparation d’une couche électro-conductrice par estampage pour former un motif de contact et des trous de référence, suivi par le plaquage d’un côté de contact de la couche. Une couche diélectrique est préparée séparément en revêtant son côté supérieur d’un adhésif. Un côté de liaison de la couche conductrice plaquée est ensuite fixé au côté revêtu d’un adhésif de la couche diélectrique dans une étape de stratification, suivi par le durcissement ultérieur de l’adhésif. Enfin, la couche diélectrique est percée pour former des trous de liaison pour des connexions électriques avec la couche électro-conductrice.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)