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1. (WO2017095181) LED LIGHTING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/095181 International Application No.: PCT/KR2016/014097
Publication Date: 08.06.2017 International Filing Date: 02.12.2016
IPC:
F21K 9/20 (2016.01) ,F21S 2/00 (2016.01) ,F21V 17/10 (2006.01) ,F21V 29/70 (2015.01) ,F21V 29/74 (2015.01) ,F21V 29/85 (2015.01) ,F21V 29/89 (2015.01) ,H01L 23/36 (2006.01) ,H01L 23/40 (2006.01) ,F21Y 101/00 (2016.01)
[IPC code unknown for F21K 9/20]
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
S
NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF
2
Systems of lighting devices, not provided for in main groups F21S4/-F21S10/119
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
17
Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
10
characterised by specific fastening means or way of fastening
[IPC code unknown for F21V 29/70][IPC code unknown for F21V 29/74][IPC code unknown for F21V 29/85][IPC code unknown for F21V 29/89]
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
Y
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V104
101
Point-like light sources
Applicants:
주식회사 아모센스 AMOSENSE CO., LTD. [KR/KR]; 충청남도 천안시 서북구 직산읍 4산단5길 90, 19-1블럭 (천안제4지방산업단지) (Cheonan the fourth Local Industrial Complex) 19-1 Block, 90, 4sandan 5-gil, Jiksan-eup, Seobuk-gu Cheonan Chungcheongnam-do 31040, KR
Inventors:
방연호 BANG, Yeun-Ho; KR
박승곤 PARK, Seung-Gon; KR
빈진혁 BIN, Jin-Hyuck; KR
Agent:
한양특허법인 HANYANG PATENT FIRM; 서울시 강남구 논현로38길 12, 한양빌딩 Hanyang building, 12, Nonhyeon-ro 38-gil, Gangnam-gu Seoul 06296, KR
Priority Data:
10-2015-017086402.12.2015KR
10-2015-017092602.12.2015KR
10-2015-017092702.12.2015KR
Title (EN) LED LIGHTING DEVICE
(FR) DISPOSITIF D'ÉCLAIRAGE À DIODES ÉLECTROLUMINESCENTES
(KO) 엘이디 조명 장치
Abstract:
(EN) Disclosed is an LED lighting device wherein the heat sink is made of a composite material, and an area, which corresponds to the LED module, is formed using a material having a higher thermal conductivity than that of the composite material such that, compared with a heat sink made of aluminum, the same is less expensive and lighter, and secures an equal or better heat-radiating performance. The disclosed LED lighting device comprises: an LED module having a plurality of LED elements mounted on one surface thereof; a heat sink coupled to the other surface of the LED module; and an auxiliary heat-radiating substrate, which is inserted into the heat sink, and one end of which contacts the other surface of the LED module, wherein the auxiliary heat-radiating substrate has a higher thermal conductivity than that of the heat sink.
(FR) La présente invention concerne un dispositif d'éclairage à diodes électroluminescentes (DEL), pour lequel le dissipateur de chaleur est réalisé en un matériau composite, et une zone, qui correspond au module à DEL, est formée à l'aide d'un matériau présentant une conductivité thermique plus élevée que celle du matériau composite de telle sorte que, par comparaison avec un dissipateur de chaleur réalisé en aluminium, il soit moins coûteux et plus léger, et garantisse des performances de rayonnement thermique égales ou meilleures. Le dispositif d'éclairage à DEL selon la présente invention comprend : un module à DEL ayant une pluralité d'éléments à DEL montés sur une surface de ce dernier; un dissipateur de chaleur couplé à l'autre surface du module à DEL; et un substrat auxiliaire à rayonnement de chaleur, qui est inséré dans le dissipateur de chaleur, et dont une extrémité vient en contact avec l'autre surface du module à DEL, le substrat auxiliaire à rayonnement de chaleur présentant une conductivité thermique supérieure à celle du dissipateur de chaleur.
(KO) 히트 싱크를 복합 재질로 제조하되 엘이디 모듈에 대응되는 영역을 복합 재질보다 높은 열전도율을 갖는 다른 재질로 형성하여 알루미늄 재질의 히트 싱크에 비해 저렴하고 가벼우면서 동등 이상의 방열 성능을 확보하도록 한 엘이디 조명 장치를 제시한다. 제시된 엘이디 조명 장치는 일면에 복수의 엘이디 소자가 실장된 엘이디 모듈, 엘이디 모듈의 타면에 결합된 히트 싱크 및 히트 싱크에 삽입되고, 일단이 엘이디 모듈의 타면에 접촉된 보조 방열 기재를 포함하고, 보조 방열 기재는 히트 싱크보다 높은 열전도율을 갖는다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)
Also published as:
CN108291692IN201817023743