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1. (WO2017095009) PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC INSULATING FILM PREPARED THEREFROM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/095009 International Application No.: PCT/KR2016/011064
Publication Date: 08.06.2017 International Filing Date: 04.10.2016
IPC:
G03F 7/027 (2006.01) ,G03F 7/033 (2006.01) ,H01B 3/44 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032
with binders
033
the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3
Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
18
mainly consisting of organic substances
30
plastics; resins; waxes
44
vinyl resins; acrylic resins
Applicants:
ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. [KR/KR]; 56, 3gongdan 1-ro, Seobuk-gu, Cheonan-si, Chungcheongnam-do 31093, KR
Inventors:
CHAE, Yu-Jin; KR
JUNG, Ju-Young; KR
KWON, Seung-Ho; KR
LEE, Jung-Hwa; KR
KIM, Seung-Keun; KR
Agent:
FIRSTLAW P.C.; 60 Mabang-Ro, Seocho-Ku, Seoul 06775, KR
Priority Data:
10-2015-017131803.12.2015KR
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC INSULATING FILM PREPARED THEREFROM
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, ET FILM ISOLANT ORGANIQUE PRÉPARÉ À PARTIR DE CETTE COMPOSITION
Abstract:
(EN) Disclosed herein are a photosensitive resin composition and an organic insulating film prepared therefrom. By optimizing the weight average molecular weight of an alkali-soluble resin and the amount of each component in the photosensitive resin composition, a coated film obtained therefrom may have high planarity property and patterns with high resolution. Accordingly, the photosensitive resin composition may be used as a material for an organic insulating film simultaneously functioning as white pixels in a liquid crystal display.
(FR) L'invention a trait à une composition de résine photosensible, et à un film isolant organique préparé à partir de cette composition. Grâce à l'optimisation de la masse moléculaire moyenne en poids d'une résine soluble dans les alcalis et de la quantité de chaque constituant dans la composition de résine photosensible, un film de revêtement obtenu à partir de cette composition peut présenter une propriété de planéité élevée et des motifs à haute résolution. En conséquence, ladite composition de résine photosensible peut être utilisée comme matériau pour un film isolant organique servant simultanément de pixels blancs dans un afficheur à cristaux liquides.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
CN108292096US20180335695