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1. (WO2017095005) ORGANIC ELECTRONIC DEVICE ADHESIVE FILM AND ORGANIC ELECTRONIC DEVICE ENCAPSULATING MATERIAL COMPRISING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/095005 International Application No.: PCT/KR2016/010884
Publication Date: 08.06.2017 International Filing Date: 29.09.2016
IPC:
C09J 7/02 (2006.01) ,H01L 51/52 (2006.01) ,H01L 51/56 (2006.01) ,C09J 11/04 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
Applicants:
주식회사 이녹스 INNOX ADVANCED MATERIALS CO., LTD. [KR/KR]; 충청남도 아산시 둔포면 아산밸리로 171 171, Asanbaelli-ro, Dunpo-myeon, Asan-si, Chungcheongnam-do 31409, KR
Inventors:
김준호 KIM, Joon Ho; KR
이휘용 LEE, Hwi Yong; KR
구본수 KOO, Bon Su; KR
박정민 PARK, Jeong Min; KR
박순천 PARK, Soon Chun; KR
Agent:
특허법인 이룸리온 ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM; 서울시 서초구 사평대로 108, 3층 (반포동) (Banpo-dong) 3rd Floor, 108, Sapyeong-daero, Seocho-gu, Seoul 06575, KR
Priority Data:
10-2015-017270004.12.2015KR
Title (EN) ORGANIC ELECTRONIC DEVICE ADHESIVE FILM AND ORGANIC ELECTRONIC DEVICE ENCAPSULATING MATERIAL COMPRISING SAME
(FR) FILM ADHÉSIF POUR DISPOSITIF ÉLECTRONIQUE ORGANIQUE ET MATÉRIAU ORGANIQUE D'ENCAPSULATION D'UN DISPOSITIF ÉLECTRONIQUE ORGANIQUE LE COMPRENANT
(KO) 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
Abstract:
(EN) The present invention relates to: an organic electronic device adhesive film; and an organic electronic device encapsulating material comprising the same and, more specifically, to: an organic electronic device adhesive film having effects of removing and blocking defect causing materials such as water and impurities, such that the materials cannot approach an organic electronic device, preventing an interlayer delamination phenomenon, which can occur when water is removed, and, simultaneously, having excellent moisture resistance and heat resistance; and an organic electronic device encapsulating material.
(FR) La présente invention concerne un film adhésif pour dispositif électronique organique et un matériau d'encapsulation d'un dispositif électronique organique le comprenant et, plus précisément : un film adhésif pour dispositif électronique organique présentant des effets d'élimination et de blocage des matériaux provoquant des défauts tels que l'eau et les impuretés, de sorte que les matériaux ne peuvent pas approcher un dispositif électronique organique, empêchant un phénomène de décollement des couches intermédiaires, qui peut se produire lorsque de l'eau est éliminée, et, simultanément, présentant une excellente résistance à l'humidité et à la chaleur; un matériau d'encapsulation d'un dispositif électronique organique.
(KO) 본 발명은 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재에 관한 것으로서, 보다 상세하게는 유기전자장치에 수분, 불순물 등의 불량원인 물질이 접근하지 못하도록 제거 및 차단하고, 수분이 제거될 때 발생할 수 있는 층간 박리현상이 일어나지 않는 동시에 내습성 및 내열성이 우수한 효과가 있는 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재에 관한 것이다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)
Also published as:
CN108368398