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1. (WO2017094957) PACKAGING MATERIAL FOR ELECTROCHEMICAL CELL CONTAINING SELF-HEALING SUBSTANCES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094957 International Application No.: PCT/KR2015/014263
Publication Date: 08.06.2017 International Filing Date: 24.12.2015
IPC:
H01M 2/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
2
Constructional details, or processes of manufacture, of the non-active parts
02
Cases, jackets, or wrappings
Applicants:
주식회사 탑앤씨 TOPNC CO., LTD. [KR/KR]; 대전시 대덕구 문평서로 8-24(문평동) (Munpyeong-dong) 8-24, Munpyeongseo-ro, Daedeok-gu Daejeon 34302, KR
Inventors:
김동수 KIM, Dong Soo; KR
배성우 BAE, Sung Woo; KR
조정민 CHO, Jung Min; KR
김도현 KIM, Do Hyun; KR
유민숙 YU, Min Sook; KR
Agent:
전유태 JUN, Yoo Tae; KR
Priority Data:
10-2015-017057802.12.2015KR
Title (EN) PACKAGING MATERIAL FOR ELECTROCHEMICAL CELL CONTAINING SELF-HEALING SUBSTANCES
(FR) MATÉRIAU D'EMBALLAGE POUR PILE ÉLECTROCHIMIQUE CONTENANT DES SUBSTANCES AUTO-RÉPARATRICES
(KO) 자가치유물질이 포함된 전기화학 셀용 포장재료
Abstract:
(EN) The present invention relates to a packaging material for an electrochemical cell containing self-healing substances, and the purpose of present invention is to improve reliability and stability by self-healing micro-cracks which may occur in a resin film when the packaging material is press-molded into a receiving space for an electrode structure. To this end, the packaging material for an electrochemical cell according to the present invention comprises a multilayer film having a structure in which a substrate layer formed as the outermost layer and made of a resin film, a barrier layer made of a metal foil, and a sealant layer for thermal bonding, formed as the innermost layer, are sequentially laminated, wherein the sealant layer contains self-healing substances.
(FR) La présente invention concerne un matériau d'emballage pour une pile électrochimique contenant des substances auto-réparatrices, et l'objectif de la présente invention consiste à améliorer la fiabilité et la stabilité par l'auto-réparation de micro-fissures qui peuvent se produire dans un film de résine lorsque le matériau d'emballage est moulé par pression dans un espace de réception pour une structure d'électrode. A cet effet, le matériau d'emballage d'une pile électrochimique selon la présente invention comprend un film multicouche ayant une structure dans laquelle une couche substrat formée en tant que couche la plus extérieure et composée d'un film de résine, une couche barrière constituée d'une feuille métallique, et une couche d'étanchéité pour liaison thermique, formée en tant que couche la plus intérieure, sont stratifiées séquentiellement, la couche d'étanchéité contenant des substances auto-réparatrices.
(KO) 본 발명은 자가치유물질이 포함된 전기화학 셀용 포장재료에 관한 것으로서, 전극 구조체의 수납공간으로 프레스 성형시 수지 필름에 발생할 할 수 있는 마이크로크랙을 스스로 치유하여 신뢰성 및 안정성을 향상시키는 것을 목적으로 한다. 이를 위하여 본 발명은, 전기화학 셀용 포장재료로서, 최외층으로써 수지 필름으로 이루어진 기재층과; 금속박으로 이루어진 배리어층과; 최내층으로서 열융착 되는 실란트층;이 순서대로 적층된 구조를 지니는 다층 필름이며, 상기 실란트층에는 자가치유물질이 포함되는 것을 특징으로 한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)
Also published as:
CN107534096