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1. (WO2017094950) HEMISPHERICAL TOUCH SENSOR PANEL THERMOFORMING APPARATUS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094950 International Application No.: PCT/KR2015/013508
Publication Date: 08.06.2017 International Filing Date: 10.12.2015
IPC:
G06F 3/041 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Applicants:
주식회사 트레이스 TRAIS CO., LTD. [KR/KR]; 경기도 안산시 단원구 별망로25번길 24 시화공단 4마 701호 #701, Sihwa Industrial Complex 4 Ma 24, Byeolmang-ro 25beon-gil Danwon-gu, Ansan-si Gyeonggi-do 15415, KR
Inventors:
김순완 KIM, Soon Wan; KR
이수재 LEE, Su Jae; KR
김홍채 KIM, Hong Chae; KR
Agent:
특허법인 하나 HANA IP LAW FIRM; 서울시 강남구 테헤란로 20길 10 6층 6F 10, Teheran-ro 20-gil Gangnam-gu Seoul 06235, KR
Priority Data:
10-2015-016830930.11.2015KR
Title (EN) HEMISPHERICAL TOUCH SENSOR PANEL THERMOFORMING APPARATUS
(FR) APPAREIL DE THERMOFORMAGE DE PANNEAU À CAPTEUR DE TOUCHER HÉMISPHÉRIQUE
(KO) 반구형 터치센서 판넬의 열성형 장치
Abstract:
(EN) The present invention relates to a hemispherical touch sensor panel thermoforming apparatus and, more specifically, to a hemispherical touch sensor panel thermoforming apparatus for forming a touch sensor panel in a hemispherical shape. Provided in one embodiment of the present invention is the hemispherical touch sensor panel thermoforming apparatus comprising: a fixing part having a circular through-hole formed at the center thereof, and provided such that the touch sensor panel can be fixed therein; a heater part positioned at the upper part of the touch sensor panel and provided so as to apply heat to the touch sensor panel; and a pressing part disposed at the lower part of the touch sensor panel and capable of being vertically lifted or lowered, wherein the pressing part applies heat and pressure to the bottom surface of the heated touch sensor panel when the pressing part is vertically lifted, so as to be provided such that the touch sensor panel forms a hemispherical shape.
(FR) La présente invention concerne un appareil de thermoformage de panneau à capteur de toucher hémisphérique, et, plus particulièrement, un appareil de thermoformage de panneau à capteur de toucher hémisphérique pour former un panneau à capteur de toucher selon une forme hémisphérique. Conformément à un mode de réalisation, la présente invention concerne un appareil de thermoformage de panneau à capteur de toucher hémisphérique comprenant : une partie de fixation ayant un trou traversant circulaire formé au centre de cette dernière, et disposée de telle sorte que le panneau à capteur de toucher peut être fixé en son sein; une partie élément chauffant positionnée au niveau de la partie supérieure du panneau à capteur de toucher et disposée de façon à appliquer de la chaleur sur le panneau à capteur de toucher; et une partie de pression disposée au niveau de la partie inférieure du panneau à capteur de toucher et capable d'être soulevée ou abaissée verticalement, la partie de pression appliquant une chaleur et une pression sur la surface inférieure du panneau à capteur de toucher chauffé lorsque la partie de pression est soulevée verticalement, de façon à être disposée de telle sorte que le panneau à capteur de toucher forme une forme hémisphérique.
(KO) 본 발명은 반구형 터치센서 판넬의 열성형 장치에 관한 것으로, 보다 상세하게는 터치센서 판넬을 반구형으로 형성하기 위한 반구형 터치센서 판넬의 열성형 장치에 관한 것이다. 본 발명의 일실시예는 중앙에 원형의 관통공이 형성되며, 내측에 터치센서 판넬이 고정 가능하도록 마련된 고정부; 상기 터치센서 판넬의 상부에 위치하여 상기 터치센서 판넬에 열을 가하도록 마련되는 히터부; 및 상기 터치센서 판넬의 하부에 배치되되, 수직으로 상승 또는 하강이 가능한 가압부를 포함하며, 상기 가압부는 수직으로 상승할 때 가열된 상기 터치센서 판넬의 하면에 열과 압력을 가함으로써, 상기 터치센서 판넬이 반구형을 형성하도록 마련되는 것인 반구형 터치센서 판넬의 열성형 장치를 제공한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)