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1. (WO2017094834) ELECTRONIC COMPONENT MODULE EQUIPPED WITH HEAT SINK AND SUBSTRATE HAVING ELECTRONIC COMPONENTS MOUNTED THEREON, AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094834 International Application No.: PCT/JP2016/085719
Publication Date: 08.06.2017 International Filing Date: 01.12.2016
IPC:
H05K 1/02 (2006.01) ,H01L 23/12 (2006.01) ,H01L 23/14 (2006.01) ,H01L 23/40 (2006.01) ,H01L 25/065 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/10 (2006.01) ,H01L 25/11 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
14
characterised by the material or its electrical properties
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10
the devices having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10
the devices having separate containers
11
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
株式会社デンソー DENSO CORPORATION [JP/JP]; 愛知県刈谷市昭和町1丁目1番地 1-1, Showa-cho, Kariya-city, Aichi 4488661, JP
Inventors:
横地 智宏 YOKOCHI, Tomohiro; JP
長谷川 賢一郎 HASEGAWA, Kenichiro; JP
梶野 秀忠 KAJINO, Hidetada; JP
笠間 康徳 KASAMA, Yasunori; JP
Agent:
東田 潔 TOHDA, Kiyoshi; JP
Priority Data:
2015-23590502.12.2015JP
Title (EN) ELECTRONIC COMPONENT MODULE EQUIPPED WITH HEAT SINK AND SUBSTRATE HAVING ELECTRONIC COMPONENTS MOUNTED THEREON, AND METHOD FOR PRODUCING SAME
(FR) MODULE À COMPOSANT ÉLECTRONIQUE ÉQUIPÉ D'UN DISSIPATEUR THERMIQUE ET SUBSTRAT SUR LEQUEL SONT MONTÉS DES COMPOSANTS ÉLECTRONIQUES, ET PROCÉDÉ DE PRODUCTION DE CEUX-CI
(JA) 電子部品を実装した基板と放熱板を備えた電子部品モジュールおよびその製造方法
Abstract:
(EN) This electronic component module, which integrally incorporates a plurality of electronic components, is provided with a substrate, a plurality of electronic components mounted on the surface of the substrate, and a heat sink that is formed from a metal and fixed on the substrate. The substrate has a first substrate section, a second substrate section, and a third substrate section. The plurality of electronic components comprise one or more first components mounted on one surface of the first substrate section, and one or more second components mounted on one surface of the second substrate section. The first and second substrate sections are arranged such that the one surface of the first substrate section and the one surface of the second substrate section face each other. The third substrate section is interposed between the first substrate section and the second substrate section such that the first, third, and second substrate sections are arranged in a row. The heat sink has a fixing part that is fixed to at least one of the first, second, and third substrate sections, and a lateral part disposed laterally to a region (R1) that is sandwiched between the first substrate section and the second substrate section. The lateral part is connected to the fixing part via a curved part having a curved shape.
(FR) L'invention concerne un module à composant électronique qui intègre complètement une pluralité de composants électroniques, comprend un substrat, une pluralité de composants électroniques montés sur la surface du substrat et un dissipateur thermique qui est constitué d'un métal et fixé sur le substrat. Le substrat possède une première section de substrat, une deuxième section de substrat et une troisième section de substrat. La pluralité de composants électroniques comprennent un ou plusieurs premiers composants montés sur une surface de la première section de substrat, et un ou plusieurs deuxièmes composants montés sur une surface de la deuxième section de substrat. Les première et deuxième sections de substrat sont disposées de telle sorte que ladite surface de la première section de substrat et ladite surface de la deuxième section de substrat se font mutuellement face. La troisième section de substrat est intercalée entre la première section de substrat et la deuxième section de substrat, de sorte que les première, deuxième et troisième sections de substrat sont disposées en une rangée. Le dissipateur thermique comporte une partie de fixation qui est fixée à au moins l'une des première, deuxième et troisième sections de substrat, et une partie latérale disposée latéralement par rapport à une région (R1) qui est prise en sandwich entre la première section de substrat et la deuxième section de substrat. La partie latérale est reliée à la partie de fixation par le biais d'une partie courbe ayant une forme courbe.
(JA) 複数の電子部品が一体化された電子部品モジュールは、基板と、 基板の表面に実装された複数の電子部品と、基板に固定され、金属で構成された放熱板とを備える。 基板は、第1基板部と、第2基板部と、第3基板部とを有し、複数の電子部品は、第1基板部の一面に実装された1つ以上の第1部品と、第2基板部の一面に実装された1つ以上の第2部品とを有し、第1基板部と第2基板部は、第1基板部の一面と第2基板部の一面とを向かい合わせにして配置されている。第3基板部が第1基板部と第2基板部の間に配置されることにより、第1基板部と、第3基板部と、第2基板部とが連なっている。放熱板は、第1基板部、第2基板部、第3基板部の少なくとも1つ以上に固定された固定部と、第1基板部と第2基板部に挟まれた領域(R1)の側方に位置する側方部とを有する。側方部は、屈曲した形状の屈曲部を介して、固定部と連なっている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180081767CN108370642