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1. (WO2017094777) OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094777 International Application No.: PCT/JP2016/085558
Publication Date: 08.06.2017 International Filing Date: 30.11.2016
IPC:
H04N 5/225 (2006.01) ,H01L 23/02 (2006.01) ,H01L 27/14 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
マイクロモジュールテクノロジー株式会社 MICRO MODULE TECHNOLOGY CO., LTD. [JP/JP]; 神奈川県横浜市鶴見区小野町75-1 リーディングベンチャープラザ1号館 Leading venture plaza 1, 75-1, Ono-cho, Tsurumi-ku, Yokohama-shi Kanagawa 2300046, JP
Inventors:
原園 文一 HARAZONO Fumikazu; JP
Agent:
坂田 ゆかり SAKATA Yukari; JP
Priority Data:
2015-23535702.12.2015JP
Title (EN) OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE
(FR) DISPOSITIF OPTIQUE ET PROCÉDÉ PERMETTANT DE FABRIQUER UN DISPOSITIF OPTIQUE
(JA) 光学装置及び光学装置の製造方法
Abstract:
(EN) The present invention makes it possible to provide a compact optical device which is less susceptible to malfunctioning due to dust. The present invention also makes it possible to reliably seal an element and a translucent member in one step. First, a solid substrate 10 is placed such that the reverse surface is oriented upward. Next, a translucent member 30 is placed inside a recess 13 so as to cover a through-hole 12 by bringing a first surface of the translucent member into contact with a protrusion 14. Next, an element 20 is placed on the reverse surface of the solid substrate 10 so as to cover the recess 13. Next, a sealing resin 40 is filled between the solid substrate 10 and the element 20, between the element 20 and a second surface of the translucent member 30 that faces the first surface, between a side surface of the translucent member 30 and the solid substrate 10, and between the first surface of the translucent member 30 and the solid substrate 10. The element 20 and the translucent member 30 are thereby integrated with the solid substrate 10.
(FR) La présente invention permet de fournir un dispositif optique compact qui est moins sujet à un mauvais fonctionnement dû à la poussière. La présente invention permet également de sceller de façon fiable un élément et un élément translucide en une étape. Tout d'abord, un substrat solide (10) est placé de telle sorte que la surface opposée soit orientée vers le haut. Ensuite, un élément translucide (30) est placé dans un renfoncement (13) de sorte à recouvrir un trou traversant (12) en amenant une première surface de l'élément translucide en contact avec une saillie (14). Ensuite, un élément (20) est placé sur la surface opposée du substrat solide (10) de sorte à recouvrir le renfoncement (13). Ensuite, une résine d'étanchéité (40) est chargée entre le substrat solide (10) et l'élément (20), entre l'élément (20) et une seconde surface de l'élément translucide (30) qui fait face à la première surface, entre une surface latérale de l'élément translucide (30) et le substrat solide (10) et entre la première surface de l'élément translucide (30) et le substrat solide (10). L'élément (20) et l'élément translucide (30) sont, de ce fait, intégrés au substrat solide (10).
(JA) 塵埃による不具合の可能性が低い小型の光学装置を提供することができる。また、1回の工程で素子と透光性部材とを確実に封止することができる。 まず、立体基板10を、裏面を上に向けた状態で載置する。次に、透光性部材の第1の面を、凸部14に当接させて、貫通孔12を覆うように凹部13の内部に透光性部材30を載置する。次に、凹部13を覆うように、立体基板10の裏面に素子20を載置する。次に、立体基板10と素子20との間、透光性部材30の第1の面と対向する第2の面と素子20との間、透光性部材30の側面と立体基板10との間、及び透光性部材30の第1の面と立体基板10との間に封止樹脂40を充填する。これにより、素子20及び透光性部材30を立体基板10に一体化する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108293088KR1020180090262US20180277583