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1. (WO2017094646) PROCESSING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094646 International Application No.: PCT/JP2016/085119
Publication Date: 08.06.2017 International Filing Date: 28.11.2016
Chapter 2 Demand Filed: 29.09.2017
IPC:
H01L 21/304 (2006.01) ,B24B 7/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
7
Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
Applicants:
株式会社東京精密 TOKYO SEIMITSU CO., LTD. [JP/JP]; 東京都八王子市石川町2968-2 2968-2, Ishikawa-machi, Hachioji-shi, Tokyo 1920032, JP
Inventors:
下田 誠 SHIMODA Makoto; JP
金澤 雅喜 KANAZAWA Masaki; JP
Agent:
清水 貴光 SHIMIZU Takamitsu; JP
Priority Data:
2015-23520101.12.2015JP
Title (EN) PROCESSING DEVICE
(FR) DISPOSITIF DE TRAITEMENT
(JA) 加工装置
Abstract:
(EN) [Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.
(FR) Le problème décrit par la présente invention est de fournir un dispositif de traitement de broyage par suppression du broyage en mode fragile et par stabilisation d'une tranche. La solution selon l’invention porte sur un dispositif de traitement (1) qui est pourvu : d'une table circulaire 2 sur laquelle une tranche W est déplacée d'un étage de broyage grossier S2 à un étage de broyage fin S3 ; d'une colonne 4 disposée de manière à couvrir l'étage de broyage grossier S2 et l'étage de broyage fin S3 ; d'un moyen de broyage grossier 5 disposé sur la colonne 4 au-dessus de l'étage de broyage grossier S2, le moyen de broyage grossier 5 réalisant un traitement de broyage grossier sur la tranche W ; et d'un moyen de broyage fin 6 disposé sur la colonne 4 au-dessus de l'étage de broyage fin S3, le moyen de meulage fin 6 réalisant un traitement de meulage fin sur la tranche W.
(JA) 【課題】脆性モード研削を抑制してウェハを安定して研削する加工装置を提供する。 【解決手段】加工装置1は、粗研削ステージS2から精研削ステージS3にウェハWを移動させるインデックステーブル2と、粗研削ステージS2及び精研削ステージS3の上方を跨ぐように設けられたコラム4と、粗研削ステージS2の上方でコラム4に設けられ、ウェハWを粗研削加工する粗研削手段5と、精研削ステージS3の上方でコラム4に設けられ、ウェハWを精研削加工する精研削手段6と、を備えている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JP2017222027JPWO2017094646KR1020180075663US20180345439