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1. (WO2017094601) SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS MOUNTED AND STRUCTURE OF CASE FOR CONTAINING SAID SUBSTRATE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094601 International Application No.: PCT/JP2016/084908
Publication Date: 08.06.2017 International Filing Date: 25.11.2016
Chapter 2 Demand Filed: 07.09.2017
IPC:
H05K 7/14 (2006.01) ,B60R 16/02 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
B PERFORMING OPERATIONS; TRANSPORTING
60
VEHICLES IN GENERAL
R
VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
16
Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
02
electric
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
日本精工株式会社 NSK LTD. [JP/JP]; 東京都品川区大崎1-6-3 1-6-3, Ohsaki, Shinagawa-Ku, Tokyo 1418560, JP
Inventors:
森本 匡一 MORIMOTO Masakazu; JP
金子 昇 KANEKO Noboru; JP
熊谷 紳 KUMAGAI Shin; JP
Agent:
安形 雄三 AGATA Yuzo; JP
Priority Data:
2015-23568802.12.2015JP
2016-03093922.02.2016JP
2016-09523211.05.2016JP
Title (EN) SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS MOUNTED AND STRUCTURE OF CASE FOR CONTAINING SAID SUBSTRATE
(FR) SUBSTRAT SUR LEQUEL UN COMPOSANT ÉLECTRONIQUE EST MONTÉ, ET STRUCTURE DE BOÎTIER DESTINÉE À CONTENIR LEDIT SUBSTRAT
(JA) 電子部品を実装した基板とその基板を収納するケースの構造
Abstract:
(EN) [Problem] To arrange a substrate, on which an electronic component is mounted, and a case for containing the substrate as close as possible to each other for the purpose of improving the heat dissipation, while maintaining the electrical insulation between the substrate and the case even if warping of the substrate occurs. [Solution] A structure of a case for containing a substrate on which an electronic component is mounted, wherein: a case main body 300 of this case has a substrate placement surface 310 on which a substrate 400 is placed; the substrate placement surface 310 is provided with a projection 330 that protrudes from the substrate placement surface 310; and the substrate 400 is affixed to the substrate placement surface 310 with a thermally conductive material TIM interposed therebetween, said thermally conductive material TIM being supplied to the substrate placement surface 310 from the periphery of the projection 330.
(FR) Le problème décrit par l'invention est de disposer un substrat, sur lequel un composant électronique est monté, et un boîtier destiné à contenir le substrat aussi près que possible l'un de l'autre dans le but d'améliorer la dissipation de chaleur, tout en maintenant l'isolation électrique entre le substrat et le boîtier même en cas de survenue d'un gauchissement du substrat. La solution de l'invention porte sur une structure d'un boîtier destiné à contenir un substrat sur lequel un composant électronique est monté, dans laquelle : un corps principal de boîtier (300) de ce boîtier présente une surface de placement de substrat (310) sur laquelle un substrat (400) est placé ; la surface de placement de substrat (310) est pourvue d'une saillie (330) qui fait saillie de la surface de placement de substrat (310) ; et le substrat (400) est fixé à la surface de placement de substrat (310) avec un matériau thermoconducteur TIM intercalé entre eux, ledit matériau thermoconducteur TIM étant apporté à la surface de placement de substrat (310) à partir de la périphérie de la saillie (330).
(JA) 【課題】 電子部品を実装した基板とその基板を収納するケースにおいて、基板とケースとを放熱性の向上のためにできるだけ近接して配置しつつ、前記基板に反りが生じても、前記基板とケースとの絶縁性が保たれるようにする。 【解決手段】 電子部品を実装した基板を収納するケースの構造であって、前記ケースのケース本体300は前記基板400を配置するための基板配置面310を有し、前記基板配置面310には、前記基板配置面310から突出する凸部330が設けられ、前記基板400は、前記基板配置面310に、前記凸部330の周囲から前記基板配置面310に配設された熱伝導材料TIMを介して固定されることとした。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108293310EP3361844US20180343737BR112018011113