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1. (WO2017094568) APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094568 International Application No.: PCT/JP2016/084655
Publication Date: 08.06.2017 International Filing Date: 22.11.2016
IPC:
C25D 5/00 (2006.01) ,C25D 5/18 (2006.01) ,C25D 7/12 (2006.01) ,C25D 21/12 (2006.01) ,H01L 21/288 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
18
Electroplating using modulated, pulsed or reversing current
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
12
Semiconductors
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21
Processes for servicing or operating cells for electrolytic coating
12
Process control or regulation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
28
Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/268158
283
Deposition of conductive or insulating materials for electrodes
288
from a liquid, e.g. electrolytic deposition
Applicants:
東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 東京都港区赤坂五丁目3番1号 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325, JP
Inventors:
星野 智久 HOSHINO, Tomohisa; JP
▲濱▼田 正人 HAMADA, Masato; JP
Agent:
金本 哲男 KANEMOTO, Tetsuo; JP
亀谷 美明 KAMEYA, Yoshiaki; JP
萩原 康司 HAGIWARA, Yasushi; JP
Priority Data:
2015-23635303.12.2015JP
Title (EN) APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
(FR) APPAREIL ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF SEMI-CONDUCTEUR
(JA) 半導体装置の製造装置及び製造方法
Abstract:
(EN) This apparatus for manufacturing a semiconductor device comprises: a substrate holding part which holds a substrate; a processing liquid supply part which supplies a processing liquid to the substrate that is held by the substrate holding part; an electrolysis treatment part which is arranged so as to face the substrate holding part and performs an electrolysis treatment on the substrate that is held by the substrate holding part; and a terminal for applying a voltage to the substrate. The electrolysis treatment part comprises: a direct electrode which is in contact with the processing liquid that is supplied to the substrate, and which applies a voltage between itself and the substrate; and an indirect electrode which forms an electric field in the processing liquid that is supplied to the substrate.
(FR) L'invention concerne un appareil de fabrication de dispositif semi-conducteur, l'appareil comprenant : une partie de maintien de substrat qui maintient un substrat ; une partie d'apport de liquide de traitement qui fournit un liquide de traitement au substrat maintenu par la partie de maintien de substrat ; une partie de traitement électrolytique qui est disposée de façon à faire face à la partie de maintien de substrat et effectue un traitement électrolytique sur le substrat maintenu par la partie de maintien de substrat ; et une borne d'application d'une tension au substrat. La partie de traitement électrolytique comprend : une électrode directe, qui est en contact avec le liquide de traitement fourni au substrat et qui applique une tension entre elle-même et le substrat ; et une électrode indirecte qui forme un champ électrique dans le liquide de traitement fourni au substrat.
(JA) 半導体装置の製造装置は、基板を保持する基板保持部と、当該基板保持部に保持された基板に処理液を供給する処理液供給部と、当該基板保持部に対向して配置され、当該基板保持部に保持された基板に電解処理を行う電解処理部と、基板に電圧を印加するための端子と、を有し、電解処理部は、基板に供給された処理液に接触しかつ基板との間で電圧を印加するための直接電極と、基板に供給された処理液に電界を形成する間接電極とを有している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108368626KR1020180087273US20180355501