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1. (WO2017094566) METHOD FOR MANAGING MANUFACTURING APPARATUS FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094566 International Application No.: PCT/JP2016/084639
Publication Date: 08.06.2017 International Filing Date: 22.11.2016
IPC:
H05B 33/10 (2006.01) ,C23C 14/00 (2006.01) ,H01L 51/50 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
Applicants:
株式会社住化分析センター SUMIKA CHEMICAL ANALYSIS SERVICE, LTD. [JP/JP]; 大阪府大阪市此花区春日出中3丁目1番135号 1-135, Kasugade-Naka 3-chome, Konohana-ku, Osaka-shi, Osaka 5540022, JP
Inventors:
末包 高史 SUEKANE, Takashi; JP
今西 克也 IMANISHI, Katsuya; JP
藤本 弘 FUJIMOTO, Hiroshi; JP
柚木▲脇▼ 智 YUKIWAKI, Satoshi; JP
吉▲崎▼ 誠 YOSHIZAKI, Makoto; JP
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
2015-23416630.11.2015JP
Title (EN) METHOD FOR MANAGING MANUFACTURING APPARATUS FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE
(FR) PROCÉDÉ DE GESTION D'UN APPAREIL DE FABRICATION POUR LA FABRICATION D'UN DISPOSITIF ÉLECTRONIQUE ORGANIQUE
(JA) 有機エレクトロニクスデバイスを製造する製造装置の管理方法
Abstract:
(EN) The present invention provides a method for managing a manufacturing apparatus that manufactures a high-performance organic electronic device, irrespective of the configuration of the organic electronic device or the manufacturing apparatus. The management method according to one embodiment of the present invention comprises a positioning step for positioning a substrate (2) inside the manufacturing apparatus (1), and a detection step for detecting impurities attached to the substrate (2), the impurities deriving from the materials of the organic electronic device and/or the manufacturing apparatus.
(FR) La présente invention concerne un procédé pour la gestion d'un appareil de fabrication qui fabrique un dispositif électronique organique haute performance, quelle que soit la configuration du dispositif électronique organique ou de l'appareil de fabrication. Le procédé de gestion selon un mode de réalisation de la présente invention comprend une étape de positionnement permettant de positionner un substrat (2) dans l'appareil de fabrication (1) et une étape de détection permettant de détecter des impuretés fixées au substrat (2), les impuretés dérivant des matériaux du dispositif électronique organique et/ou de l'appareil de fabrication.
(JA) 有機エレクトロニクスデバイスまたは製造装置の構成にかかわらず、高性能な有機エレクトロニクスデバイスを製造する製造装置の管理方法を提供する。本発明の一実施形態に係る管理方法は、製造装置(1)内に基材(2)を配置する配置工程と、基材(2)に付着した、有機エレクトロニクスデバイスおよび製造装置の少なくとも一方の材料に由来する不純物を検出する検出工程と、を含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180085020