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1. (WO2017094537) SEMICONDUCTOR CHIP AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094537 International Application No.: PCT/JP2016/084382
Publication Date: 08.06.2017 International Filing Date: 21.11.2016
IPC:
H01L 27/14 (2006.01) ,G02B 5/26 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5
Optical elements other than lenses
20
Filters
26
Reflecting filters
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
佐々木 直人 SASAKI Naoto; JP
大岡 豊 OOKA Yutaka; JP
Agent:
西川 孝 NISHIKAWA Takashi; JP
稲本 義雄 INAMOTO Yoshio; JP
Priority Data:
2015-23645003.12.2015JP
Title (EN) SEMICONDUCTOR CHIP AND ELECTRONIC DEVICE
(FR) PUCE À SEMI-CONDUCTEUR ET DISPOSITIF ÉLECTRONIQUE
(JA) 半導体チップ及び電子機器
Abstract:
(EN) The present invention pertains to a semiconductor chip and an electronic device configured so as to make it possible to suppress deterioration of optical characteristics of the semiconductor chip, which is provided with an imaging element. The semiconductor chip is provided with: an imaging element; a transparent protective member for protecting the imaging element; an IR cut film disposed between the light-receiving surface of the imaging element and the protective member; a bonding layer for bonding the IR cut film and the protective member; and a protective film for covering the side surfaces of the IR cut film and the bonding layer. The present invention is applicable, for example, to a semiconductor chip for an imaging element.
(FR) La présente invention concerne une puce à semi-conducteur et un dispositif électronique configuré de manière à permettre de supprimer la détérioration des caractéristiques optiques de la puce à semi-conducteur, qui est dotée d'un élément d'imagerie. La puce à semi-conducteur est pourvue de : un élément d'imagerie; un élément de protection transparent pour protéger l'élément d'imagerie; un film bloquant les IR disposé entre la surface de réception de lumière de l'élément d'imagerie et l'élément de protection; une couche de liaison destinée à lier le film bloquant les IR et l'élément de protection; et un film de protection destiné à recouvrir les surfaces latérales du film bloquant les IR et la couche de liaison. La présente invention est applicable, par exemple, à une puce à semi-conducteur pour un élément d'imagerie.
(JA) 本技術は、撮像素子を備える半導体チップの光学特性の劣化を抑制することができるようにする半導体チップ及び電子機器に関する。 半導体チップは、撮像素子と、前記撮像素子を保護する透明な保護部材と、前記撮像素子の受光面と前記保護部材との間に配置されているIRカット膜と、前記IRカット膜と前記保護部材とを接合する接合層と、前記IRカット膜及び前記接合層の側面を覆う保護膜とを備える。本技術は、例えば、撮像素子用の半導体チップに適用することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108292662US20180348415