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1. (WO2017094489) THERMALLY CURABLE RESIN COMPOSITION, THERMALLY CURABLE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094489 International Application No.: PCT/JP2016/083756
Publication Date: 08.06.2017 International Filing Date: 15.11.2016
IPC:
C08L 101/12 (2006.01) ,C08K 5/3477 (2006.01) ,C08K 5/523 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/46 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
12
characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
16
Nitrogen-containing compounds
34
Heterocyclic compounds having nitrogen in the ring
3467
having more than two nitrogen atoms in the ring
3477
Six-membered rings
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
49
Phosphorus-containing compounds
51
Phosphorus bound to oxygen
52
bound to oxygen only
521
Esters of phosphoric acids, e.g. of H3PO4
523
with hydroxyaryl compounds
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
ナミックス株式会社 NAMICS CORPORATION [JP/JP]; 新潟県新潟市北区濁川3993番地 3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata 9503131, JP
Inventors:
黒川 津与志 KUROKAWA Tsuyoshi; JP
大橋 聡子 OHASHI Satoko; JP
吉田 真樹 YOSHIDA Masaki; JP
Agent:
渡會 祐介 WATARAI Yusuke; JP
Priority Data:
2015-23283930.11.2015JP
Title (EN) THERMALLY CURABLE RESIN COMPOSITION, THERMALLY CURABLE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE THERMIQUEMENT DURCISSABLE, FILM DE RÉSINE THERMIQUEMENT DURCISSABLE, CARTE DE CIRCUIT IMPRIMÉ, ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 熱硬化性樹脂組成物、熱硬化性樹脂フィルム、プリント配線板、および半導体装置
Abstract:
(EN) The purpose of the present invention is to provide a thermally curable resin composition which is capable of forming an insulating film having excellent dielectric properties, high flame retardancy, and high adhesive force, without requiring the use of any conventional halogen-compound flame retardant. The thermally curable resin composition is characterized by comprising (A) an aromatic polyphosphate ester, (B) melamine cyanurate, and (C) a resin having a relative permittivity of 2.9 or less at a frequency of 1.9 GHz, the sum of the components (A) and (B) being 45 parts by mass or more per 100 parts by mass of the component (C), and the content of the component (A) being higher than that of the component (B). It is preferable that the thermally curable resin composition have a relative permittivity of 3.0 or less at a frequency of 1.9 GHz.
(FR) Le but de la présente invention est de fournir une composition de résine thermiquement durcissable qui est capable de former un film isolant présentant d’excellentes propriétés diélectriques, une ignifugation élevée, et une force d’adhésion élevée, sans nécessiter l’utilisation de quelconque agent ignifuge halogène classique. La composition de résine thermiquement durcissable est caractérisée en ce qu’elle comprend (A) un polyphosphate ester aromatique, (B) un cyanurate de mélamine, et (C) une résine présentant une permittivité relative de 2,9 ou moins à une fréquence de 1,9 GHz, la somme des constituants (A) et (B) étant de 45 parties en masse ou plus pour 100 parties en masse du constituant (C), et la teneur du constituant (A) étant supérieure à celle du constituant (B). Il est préférable que la composition de résine thermiquement durcissable présente une relative permittivité de 3,0 ou moins à une fréquence de 1,9 GHz.
(JA) 従来のハロゲン系難燃剤を使用せずに、誘電特性に優れ、難燃性が高く、接着力の高い絶縁性フィルムを形成し得る、熱硬化性樹脂組成物を提供することを目的とする。 (A)芳香族縮合リン酸エステルと、(B)メラミンシアヌレートと、(C)周波数1.9GHzでの比誘電率が2.9以下である樹脂と、を含み、(C)成分100質量部に対する(A)成分と(B)成分との合計が45質量部以上であり、(A)成分が(B)成分より多いことを特徴とする、熱硬化性樹脂組成物である。周波数1.9GHzでの比誘電率が、3.0以下である熱硬化性樹脂組成物であると、好ましい。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108368349KR1020180088659