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1. (WO2017094370) POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC CAR OR HYBRID CAR
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094370 International Application No.: PCT/JP2016/080658
Publication Date: 08.06.2017 International Filing Date: 17.10.2016
IPC:
H01L 25/07 (2006.01) ,B60K 11/02 (2006.01) ,H01L 23/473 (2006.01) ,H01L 25/18 (2006.01) ,H02M 7/48 (2007.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
B PERFORMING OPERATIONS; TRANSPORTING
60
VEHICLES IN GENERAL
K
ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS; AUXILIARY DRIVES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST, OR FUEL SUPPLY, OF PROPULSION UNITS, IN VEHICLES
11
Arrangement in connection with cooling of propulsion units
02
with liquid cooling
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
473
by flowing liquids
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
M
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
7
Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
42
Conversion of dc power input into ac power output without possibility of reversal
44
by static converters
48
using discharge tubes with control electrode or semiconductor devices with control electrode
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
ローム株式会社 ROHM CO., LTD. [JP/JP]; 京都府京都市右京区西院溝崎町21番地 21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto-shi, Kyoto 6158585, JP
Inventors:
吉原 克彦 YOSHIHARA, Katsuhiko; JP
濟藤 匡男 SAITO, Masao; JP
Agent:
三好 秀和 MIYOSHI, Hidekazu; JP
寺山 啓進 TERAYAMA, Keishin; JP
Priority Data:
2015-23745804.12.2015JP
Title (EN) POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC CAR OR HYBRID CAR
(FR) APPAREIL DE MODULE DE PUISSANCE, STRUCTURE DE REFROIDISSEMENT, ET VOITURE ÉLECTRIQUE OU VOITURE HYBRIDE
(JA) パワーモジュール装置、冷却構造体、および電気自動車またはハイブリッドカー
Abstract:
(EN) A power module apparatus (10) is provided with: a power module (100A) including a semiconductor device that performs power switching, a package (110) that seals the outer surrounding of the semiconductor device, and a radiator (42) joined to one surface of the package (110); and a cooling device (30) including a cooling water path (33) through which cooling water passes, the cooling water path (33) being provided with an opening portion (35) in the middle of the cooling water path (33) such that the radiator (42) of the power module (100A) is attached to the opening portion (35). The radiator (42) of the power module (100A) is attached to the opening portion (35) of the cooling water path (33) such that the height ha from the uppermost portion (33T) to the lowermost portion (33B) of the opening portion (35) of the cooling water path (33) is substantially equal to the height hb from the lowermost portion (33B) of the opening portion (35) of the cooling water path (33) to a base end portion (PB) opposite to the joined surface, of the radiator (42), relative to the package (110). Provided is a power module apparatus capable of efficiently cooling a power module configured to have a radiator attached to an opening portion formed in the upper surface portion of a cooling device, and of suppressing deterioration caused by overheat.
(FR) L'invention concerne un appareil de module de puissance (10) qui comprend : un module de puissance (100A) comprenant un dispositif à semi-conducteur qui effectue une commutation de puissance, un boîtier (110) qui isole le pourtour extérieur du dispositif à semi-conducteur, et un radiateur (42) assemblé à une surface du boîtier (110) ; et un dispositif de refroidissement (30) comprenant un circuit d'eau de refroidissement (33) dans lequel circule de l'eau de refroidissement, le circuit d'eau de refroidissement (33) comprenant une partie ouverture (35) au milieu du circuit d'eau de refroidissement (33) de manière que le radiateur (42) du module de puissance (100A) est fixé à la partie ouverture (35). Le radiateur (42) du module de puissance (100A) est fixé à la partie ouverture (35) du circuit d'eau de refroidissement (33) de manière que la hauteur ha de la partie supérieure (33T) à la partie inférieure (33B) de la partie ouverture (35) du circuit d'eau de refroidissement (33) soit sensiblement égale à la hauteur hb de la partie inférieure (33B) de la partie ouverture (35) du circuit d'eau de refroidissement (33) à une partie d'extrémité de base (PB) opposée à la surface assemblée du radiateur (42) par rapport au boîtier (110). L'invention concerne un appareil de module de puissance permettant de refroidir efficacement un module de puissance configuré pour comporter un radiateur fixé à une partie d'ouverture formée dans la partie de surface supérieure d'un dispositif de refroidissement, et de supprimer une détérioration causée par une surchauffe.
(JA) パワーモジュール装置(10)は、電力のスイッチングを行う半導体デバイスと、半導体デバイスの外囲を封止するパッケージ(110)と、パッケージ(110)の一面に接合された放熱器(42)とを有するパワーモジュール(100A)と、冷却水が流れる冷却水路(33)を有し、パワーモジュール(100A)の放熱器(42)が冷却水路(33)の途中に設けられた開口部(35)に装着される冷却装置(30)とを備え、冷却水路(33)の開口部(35)の最上部(33T)から最下部(33B)までの高さhaと、冷却水路(33)の開口部(35)の最下部(33B)から放熱器(42)のパッケージ(110)との接合面に対向する基端部(PB)までの高さhbとが、実質的に同一となるようにパワーモジュール(100A)の放熱器(42)が冷却装置(30)の開口部(35)に装着される。冷却装置の上面部に形成された開口部に放熱器を装着するようにしたパワーモジュールを効率よく冷却でき、過熱による劣化を抑えることが可能なパワーモジュール装置を提供する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
DE112016005528US20180286781CN108701688