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1. (WO2017094283) PACKAGE BOARD, MOTHER BOARD, ELECTRONIC COMPONENT, AND ACOUSTIC WAVE DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094283 International Application No.: PCT/JP2016/070789
Publication Date: 08.06.2017 International Filing Date: 14.07.2016
IPC:
H01L 23/12 (2006.01) ,H01L 23/00 (2006.01) ,H03H 9/25 (2006.01) ,H05K 1/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25
Constructional features of resonators using surface acoustic waves
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
是枝 俊成 KOREEDA, Toshishige; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2015-23295430.11.2015JP
Title (EN) PACKAGE BOARD, MOTHER BOARD, ELECTRONIC COMPONENT, AND ACOUSTIC WAVE DEVICE
(FR) CARTE MISE SOUS BOÎTIER, CARTE MÈRE, COMPOSANT ÉLECTRONIQUE ET DISPOSITIF À ONDES ACOUSTIQUES
(JA) パッケージ基板、マザー基板、電子部品及び弾性波装置
Abstract:
(EN) Provided is a package board whereby direction discrimination can be reliably performed without making manufacturing steps complicated. An acoustic wave element 4 as an electronic component element is mounted on a package board 2. A plurality of electrode pads 3a-3f are provided on a first main surface 2a of the package board 2, and the acoustic wave element 4 is bonded. The planar shape of at least one electrode pad 3a among the electrode pads 3a-3f is different from the planar shapes of other electrode pads 3b-3f.
(FR) La présente invention porte sur une carte mise sous boîtier, par laquelle une discrimination de direction peut être réalisée de manière fiable sans étapes de fabrication compliquées. Un élément à ondes acoustiques (4) servant d'élément de composant électronique est monté sur une carte mise sous boîtier (2). Une pluralité de plages d'électrode (3a-3f) sont disposées sur une première surface principale (2a) de la carte mise sous boîtier (2), et l'élément à ondes acoustiques (4) est lié. La forme plane d'au moins une plage d'électrode (3a) parmi les plages électrode (3a-3f) est différente des formes planes des autres plages d'électrode (3b-3f).
(JA)  製造工程の煩雑さを招くことなく、方向選別を確実に行い得るパッケージ基板を提供する。 電子部品素子としての弾性波素子4が搭載されるパッケージ基板2。パッケージ基板2の第1の主面2a上に複数の電極パッド3a~3fが設けられており、弾性波素子4が接合される。複数の電極パッド3a~3fのうち、少なくとも1個の電極パッド3aの平面形状が、他の電極パッド3b~3fの平面形状と異なっている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)