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1. (WO2017094264) SUBSTRATE EQUIPPED WITH ELECTROCONDUCTIVE FILM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094264 International Application No.: PCT/JP2016/005029
Publication Date: 08.06.2017 International Filing Date: 30.11.2016
IPC:
B32B 7/02 (2006.01) ,B32B 27/00 (2006.01) ,C09D 4/00 (2006.01) ,C09D 5/00 (2006.01) ,C09D 5/24 (2006.01) ,C09D 7/12 (2006.01) ,C09D 11/52 (2014.01) ,C09D 183/04 (2006.01) ,H01B 1/22 (2006.01) ,H01B 5/14 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
4
Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5
Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5
Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
24
Electrically-conducting paints
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7
Features of coating compositions, not provided for in group C09D5/88
12
Other additives
[IPC code unknown for C09D 11/52]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
183
Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
04
Polysiloxanes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
14
comprising conductive layers or films on insulating-supports
Applicants:
日本曹達株式会社 NIPPON SODA CO., LTD. [JP/JP]; 東京都千代田区大手町2丁目2番1号 2-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1008165, JP
Inventors:
三枝 栄子 MIEDA, Eiko; JP
Agent:
廣田 雅紀 HIROTA, Masanori; JP
Priority Data:
2015-23636603.12.2015JP
Title (EN) SUBSTRATE EQUIPPED WITH ELECTROCONDUCTIVE FILM
(FR) SUBSTRAT ÉQUIPÉ D'UN FILM ÉLECTROCONDUCTEUR
(JA) 導電膜付き基材
Abstract:
(EN) The purpose of the present invention is to provide a substrate equipped with an electroconductive film, the substrate having an electroconductive film in which the surface is devoid of irregularities, and the adhesion between the electroconductive film and a plastic substrate being excellent regardless of the type of electroconductive ink. A substrate equipped with an electroconductive film having a base film and the electroconductive film on the surface of a substrate in the stated order, wherein the base film is an object obtained by curing a coating agent containing a condensate of an organosilane compound represented by formula (II) R4Si(R3)3 (II) (where: R4 represents an epoxy group, etc.; and R3 represents a hydroxyl group or a hydrolyzable group) and a compound represented by formula (I) (where: Ar represents a C6-C10 aryl group optionally having an electron-donating group; X represents a single bond, etc.; Y represents a polymerizable functional group; Z represents a carbon atom or a silicon atom; R2 represents a hydrogen atom, etc.; and Ar may be identical or different to each other).
(FR) La présente invention concerne un substrat équipé d'un film électroconducteur, le substrat ayant un film électroconducteur dans lequel la surface est dépourvue d'irrégularités et l'adhérence entre le film électroconducteur et un substrat en plastique étant excellente quel que soit le type d'encre électroconductrice. Un substrat équipé d'un film électroconducteur ayant un film de base et le film électroconducteur sur la surface d'un substrat dans l'ordre mentionné, le film de base étant un objet obtenu par durcissement d'un agent de revêtement contenant un condensat d'un composé d'organosilane représenté par la formule (II) R4Si(R3)3 (II) (où : R4 représente un groupe époxy et autres ; et R3 représente un groupe hydroxyle ou un groupe hydrolysable) et un composé représenté par la formule (I) (où : Ar représente un groupe aryle en C6 à C10 ayant facultativement un groupe donneur d'électron ; X représenté une liaison unique et autres ; Y représente un groupe fonctionnel polymérisable ; Z représente un atome de carbone ou un atome de silicium ; R2 représente un atome d'hydrogène et autres ; et les éléments Ar peuvent être identiques ou différents les uns des autres).
(JA) 本発明は、導電性インクの種類によらずプラスチック基材と導電膜との密着性が良好であり、表面にムラのない導電膜を有する導電膜付き基材を提供することを目的とする。 基材の表面上に、下地膜及び導電膜を、この順で有する導電膜付き基材であって、 前記下地膜が、式(I)(式中、Arは、電子供与性基を有していてもよいC6~C10のアリール基を示す。Xは、単結合等を示す。Yは、重合可能な官能基を示し、Zは、炭素原子又はケイ素原子を示す。Rは、水素原子等を示す。ここで、各Arは、同一でも相異なっていてもよい。)で表される化合物と、 式(II) RSi(R  (II) (式中、Rは、エポキシ基等を示す。Rは、水酸基又は加水分解性基を示す。)で表される有機シラン化合物の縮合物を含有するコーティング剤の硬化物である膜である、導電膜付き基材。
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African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)