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1. (WO2017094176) CROSS-SECTIONAL OBSERVATION SAMPLE PREPARATION DEVICE AND CROSS-SECTIONAL OBSERVATION SAMPLE PREPARATION METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/094176 International Application No.: PCT/JP2015/084093
Publication Date: 08.06.2017 International Filing Date: 04.12.2015
IPC:
G01N 1/28 (2006.01) ,B81C 99/00 (2010.01) ,G01N 1/32 (2006.01) ,H01J 37/20 (2006.01)
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
1
Sampling; Preparing specimens for investigation
28
Preparing specimens for investigation
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
99
Subject matter not provided for in other groups of this subclass
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
1
Sampling; Preparing specimens for investigation
28
Preparing specimens for investigation
32
Polishing; Etching
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
02
Details
20
Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
Applicants:
株式会社日立製作所 HITACHI, LTD. [JP/JP]; 東京都千代田区丸の内一丁目6番6号 6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008280, JP
Inventors:
渡邉 敬司 WATANABE Keiji; JP
河村 哲史 KAWAMURA Tetsufumi; JP
峰 利之 MINE Toshiyuki; JP
杉井 信之 SUGII Nobuyuki; JP
龍崎 大介 RYUZAKI Daisuke; JP
Agent:
青稜特許業務法人 SEIRYO I.P.C.; 東京都中央区八丁堀二丁目24番2号 24-2, Hatchobori 2-chome, Chuo-ku, Tokyo 1040032, JP
Priority Data:
Title (EN) CROSS-SECTIONAL OBSERVATION SAMPLE PREPARATION DEVICE AND CROSS-SECTIONAL OBSERVATION SAMPLE PREPARATION METHOD
(FR) DISPOSITIF DE PRÉPARATION D’ÉCHANTILLON POUR OBSERVATION EN COUPE, ET PROCÉDÉ DE PRÉPARATION D’ÉCHANTILLON POUR OBSERVATION EN COUPE
(JA) 断面観察試料作製装置及び断面観察試料作製方法
Abstract:
(EN) A cross-sectional observation sample preparation device (100) comprises: a support stand (11); a beam irradiation gun (12); a probe (13); a filler supply line for supplying a filler toward the surface of a semiconductor substrate (41) supported on the support stand (11); a discharge nozzle (23) that is connected to the filler supply line and discharges the filler onto the surface of the semiconductor substrate (41); a suction nozzle (33) for suctioning the filler from the surface of the semiconductor substrate (41); a vacuum line (31) for recovering the filler that has been suctioned from the suction nozzle (33); a temperature control mechanism (71) for controlling the temperature of the support stand (11); a discharge nozzle movement mechanism (74) for moving the discharge nozzle (23); and a suction nozzle movement mechanism (75) for moving the suction nozzle (33).
(FR) L'invention concerne un dispositif de préparation d'échantillon pour observation en coupe (100) qui comprend : un socle de support (11) ; un pistolet d'irradiation de faisceau (12) ; une sonde (13) ; une conduite d'alimentation de charge pour fournir une charge vers la surface d'un substrat semi-conducteur (41) maintenu sur le socle de support (11) ; une buse d'évacuation (23) qui est reliée à la conduite d'alimentation de charge et évacue la charge sur la surface du substrat semi-conducteur (41) ; une buse d'aspiration (33) pour aspirer la charge depuis la surface du substrat semi-conducteur (41) ; une conduite de vide (31) pour récupérer la charge qui a été aspirée par la buse d'aspiration (33) ; un mécanisme de régulation de température (71) pour réguler la température du socle de support (11) ; un mécanisme de mouvement de buse d'évacuation (74) pour déplacer la buse d'évacuation (23) ; et un mécanisme de mouvement de buse d'aspiration (75) pour déplacer la buse d'aspiration (33).
(JA) 支持台(11)と、ビーム照射銃(12)と、プローブ(13)と、支持台(11)に支持される半導体基板(41)の表面に向けて充填材を供給する充填材供給ラインと、充填材供給ラインに接続され、半導体基板(41)の表面に充填材を吐出する吐出ノズル(23)と、半導体基板(41)の表面から充填材を吸引する吸引ノズル(33)と、吸引ノズル(33)から吸引された充填材を回収する真空ライン(31)と、支持台(11)の温度を制御する温度制御機構(71)と、吐出ノズル(23)を移動させる吐出ノズル移動機構(74)と、吸引ノズル(33)を移動させる吸引ノズル移動機構(75)と、を有する断面観察試料作製装置(100)である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)