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1. (WO2017093823) METHODS AND SYSTEMS FOR MAKING PIEZOELECTRIC CANTILEVER ACTUATORS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/093823 International Application No.: PCT/IB2016/056487
Publication Date: 08.06.2017 International Filing Date: 27.10.2016
Chapter 2 Demand Filed: 11.08.2017
IPC:
H01L 41/113 (2006.01) ,H01L 41/09 (2006.01) ,H01L 41/22 (2013.01) ,B81B 3/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08
Piezo-electric or electrostrictive elements
113
with mechanical input and electrical output
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08
Piezo-electric or electrostrictive elements
09
with electrical input and mechanical output
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22
Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
B
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
3
Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
Applicants:
SABIC GLOBAL TECHNOLOGIES, B.V. [NL/NL]; Plasticslaan 1 4612 PX Bergen Op Zoom, NL
Inventors:
CARAVEO, Jesus Alfonso; SA
AL-HOWAISH, Ibrahim; SA
ALMADHOUN, Mahmoud N.; SA
ALDUBAYAN, Abdulaziz Hamad M.; SA
Agent:
COTTRILL, Emily; 10 Old Bailey London EC4M 7NG, GB
Priority Data:
62/260,98230.11.2015US
Title (EN) METHODS AND SYSTEMS FOR MAKING PIEZOELECTRIC CANTILEVER ACTUATORS
(FR) PROCÉDÉS ET SYSTÈMES DE FABRICATION D'ACTIONNEURS PIÉZOÉLECTRIQUES EN PORTE-À-FAUX
Abstract:
(EN) A method of fabricating a microelectronic device comprising providing a substrate comprising a first bottom surface, providing a mold comprising a first top surface with first projections, and punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate. A piezoelectric cantilever actuator system array prepared by a process comprising the steps of providing a substrate comprising a first bottom surface, providing a mold comprising a first top surface with first projections, and punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate. A microelectronic device comprising a base, a first anchor coupled to the base, and a first cantilever coupled to the first anchor, wherein the base, the first anchor, and the first cantilever are an integral structure formed from the same substrate material.
(FR) L'invention concerne un procédé de réalisation d'un dispositif microélectronique, comportant les étapes consistant à mettre en place un substrat comportant une première surface inférieure, à mettre en place un moule comportant une première surface supérieure présentant des premières protubérances, et à poinçonner les premières protubérances à travers la première surface inférieure pour définir des ancrages, des ébauches de porte-à-faux et des cavités dans le substrat. L'invention concerne également un réseau de systèmes d'actionneurs piézoélectriques en porte-à-faux préparé par un processus comportant les étapes consistant à mettre en place un substrat comportant une première surface inférieure, à mettre en place un moule comportant une première surface supérieure présentant des premières protubérances, et à poinçonner les premières protubérances à travers la première surface inférieure pour définir des ancrages, des ébauches de porte-à-faux et des cavités dans le substrat. L'invention concerne également un dispositif microélectronique comportant une base, un premier ancrage couplé à la base et un premier porte-à-faux couplé au premier ancrage, la base, le premier ancrage et le premier porte-à-faux étant une structure intégrée formée du même matériau de substrat.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)