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1. (WO2017093116) ELECTRONIC POWER MODULE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/093116 International Application No.: PCT/EP2016/078680
Publication Date: 08.06.2017 International Filing Date: 24.11.2016
Chapter 2 Demand Filed: 14.08.2017
IPC:
H01L 23/373 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants:
AUDI AG [DE/DE]; 85045 Ingolstadt, DE
ABB SCHWEIZ AG; Brown Boveri Straße 6 5400 Baden, CH
Inventors:
APELSMEIER, Andreas; DE
VETTER, Günter; DE
Priority Data:
10 2015 015 699.304.12.2015DE
Title (DE) ELEKTRONISCHES LEISTUNGSMODUL
(EN) ELECTRONIC POWER MODULE
(FR) MODULE ÉLECTRONIQUE DE PUISSANCE
Abstract:
(DE) Elektronisches Leistungsmodul, umfassend wenigstens ein Halbleiterbauelement, das auf einem Träger angeordnet ist, sowie einen Kühlkörper, der in thermischem Kontakt mit dem Halbleiterbauelement steht, wobei der Träger (2) aus einem Halbleitermaterial besteht und zugleich als Kühlkörper dient.
(EN) The invention relates to an electronic power module, comprising at least one semiconductor component which is arranged on a support, and a cooling body which is in thermal contact with the semiconductor component, the support (2) being made of a semiconductor material and serving at the same time as a cooling body.
(FR) Module électronique de puissance qui comporte au moins un composant semi-conducteur disposé sur un support, ainsi qu’un corps de refroidissement se trouvant en contact thermique avec le composant semi-conducteur, ledit support (2) étant constitué d’un matériau semi-conducteur et servant en même temps de corps de refroidissement.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)
Also published as:
CN108292638EP3384527US20180358282