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1. (WO2017092482) HALOGEN-FREE EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD CONTAINING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/092482 International Application No.: PCT/CN2016/099121
Publication Date: 08.06.2017 International Filing Date: 14.09.2016
IPC:
C08L 63/00 (2006.01) ,C08L 79/04 (2006.01) ,C08L 35/06 (2006.01) ,H05K 1/03 (2006.01) ,C08K 13/02 (2006.01) ,C08J 5/24 (2006.01) ,B32B 15/092 (2006.01) ,B32B 27/38 (2006.01) ,C08G 59/40 (2006.01) ,C08G 59/42 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
35
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
06
Copolymers with vinyl aromatic monomers
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
13
Use of mixtures of ingredients not covered by any single one of main groups C08K3/-C08K11/128
02
Organic and inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
092
comprising epoxy resins
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
38
comprising epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
42
Polycarboxylic acids; Anhydrides, halides, or low-molecular-weight esters thereof
Applicants:
广东生益科技股份有限公司 SHENGYI TECHNOLOGY CO., LTD. [CN/CN]; 中国广东省东莞市 松山湖高新技术产业开发区工业西路5号 No.5 Western Industry Road, Songshan Lake National High-Tech Industrial Development Zone Dongguan, Guangdong 523808, CN
Inventors:
李辉 LI, Hui; CN
方克洪 FANG, Kehong; CN
许永静 XU, Yongjing; CN
Agent:
北京品源专利代理有限公司 BEYOND ATTORNEYS AT LAW; 中国北京市 海淀区莲花池东路39号西金大厦6层 F6, Xijin Centre 39 Lianhuachi East Rd., Haidian District Beijing 100036, CN
Priority Data:
201510888933.304.12.2015CN
Title (EN) HALOGEN-FREE EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD CONTAINING SAME
(FR) COMPOSITION DE RÉSINE ÉPOXY EXEMPTE D'HALOGÈNE, ET PRÉIMPRÉGNÉ, CARTE STRATIFIÉE ET CARTE DE CIRCUIT IMPRIMÉ LA CONTENANT
(ZH) 无卤环氧树脂组合物以及含有它的预浸料、层压板和印制电路板
Abstract:
(EN) Provided are a halogen-free epoxy resin composition and a prepreg and a laminated board containing same, falling within the technical field of copper clad laminates. The halogen-free epoxy resin composition comprises the following components, in parts by weight: 60 parts by weight of an epoxy resin, 15-28 parts by weight of a benzoxazine resin and 10-20 parts by weight of styrene-maleic anhydride. By selecting 15-28 parts by weight of a benzoxazine resin and 10-20 parts by weight of styrene-maleic anhydride for curing 60 parts by weight of an epoxy resin, the stability of Df value of a prepreg under different curing temperature conditions is guaranteed while a low dielectric constant and a low dielectric loss can be kept. A prepreg and a laminated board prepared by using the resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame resistance, heat resistance, cohesiveness, a low water absorption and an wet resistance, and are suitable for use in a halogen-free and high multilayer circuit board.
(FR) L'invention concerne une composition de résine époxy exempte d'halogène et un préimprégné et une carte stratifiée la contenant, entrant dans le domaine technique des stratifiés revêtus de cuivre. La composition de résine époxy exempte d'halogènes comprend les constituants suivants, en parties en poids : 60 parties en poids d'une résine époxy, 15 à 28 parts en poids d'une résine de benzoxazine et 10 à 20 parties en poids de styrène-anhydride maléique. En sélectionnant 15 à 28 parties en poids d'une résine de benzoxazine et 10 à 20 parties en poids de styrène-anhydride maléique pour durcir 60 parties en poids d'une résine époxy, la stabilité de la valeur Df d'un préimprégné dans différentes conditions de température de durcissement est garantie tandis qu'une constante diélectrique faible et une perte diélectrique faible peuvent être maintenues. Un préimprégné et une carte stratifiée préparés à l'aide de la composition de résine présentent des performances complètes telles qu'une constante diélectrique faible, une faible perte diélectrique, une excellente résistance à la flamme, une résistance à la chaleur, une cohésion, une faible absorption d'eau et une résistance à l'humidité, et sont appropriés pour être utilisés dans une carte de circuit multicouche haute fréquence exempte d'halogène.
(ZH) 一种无卤环氧树脂组合物以及含有它的预浸料和层压板,属于覆铜板技术领域。所述无卤环氧树脂组合物,其按重量份数包括如下组分:环氧树脂60重量份、苯并噁嗪树脂15~28重量份以及苯乙烯-马来酸酐10~20重量份。通过选择15~28重量份的苯并噁嗪树脂和10~20重量份的苯乙烯-马来酸酐固化60重量份的环氧树脂,可以在保持低介电常数、低介质损耗的同时,保证了预浸料在不同固化温度条件下Df值的稳定性。使用该树脂组合物制备的预浸料及层压板,具有低介电常数、低介质损耗、优异的阻燃性、耐热性、粘结性、低的吸水率及耐湿性等综合性能,适合在无卤高多层电路板中使用。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)
Also published as:
US20170283610