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1. (WO2017092471) THERMOSETTING ALKYL POLYOL GLYCIDYL ETHER RESIN COMPOSITION AND APPLICATION THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/092471 International Application No.: PCT/CN2016/098478
Publication Date: 08.06.2017 International Filing Date: 08.09.2016
IPC:
C08L 63/00 (2006.01) ,C08G 59/22 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20
characterised by the epoxy compounds used
22
Di-epoxy compounds
Applicants:
广东生益科技股份有限公司 SHENGYI TECHNOLOGY CO., LTD. [CN/CN]; 中国广东省东莞市 松山湖高新技术产业开发区工业西路5号 No.5 Western Industry Road, Songshan Lake National High-Tech Industrial Development Zone Dongguan, Guangdong 523808, CN
Inventors:
袁婵娥 YUAN, Chane; CN
罗鸿运 LUO, Hongyun; CN
Agent:
北京品源专利代理有限公司 BEYOND ATTORNEYS AT LAW; 中国北京市 海淀区莲花池东路39号西金大厦6层 F6, Xijin Centre 39 Lianhuachi East Rd., Haidian District Beijing 100036, CN
Priority Data:
201510882430.502.12.2015CN
Title (EN) THERMOSETTING ALKYL POLYOL GLYCIDYL ETHER RESIN COMPOSITION AND APPLICATION THEREOF
(FR) COMPOSITION DE RÉSINE D'ÉTHER GLYCIDYLIQUE DE POLYOL ALKYLIQUE THERMODURCISSABLE ET APPLICATION ASSOCIÉE
(ZH) 热固性烷基多元醇缩水甘油醚树脂组合物及其应用
Abstract:
(EN) Provided is a thermosetting alkyl polyol glycidyl ether resin composition and application thereof. The resin composition is composed of epoxy resin as the main resin component. The epoxy resin comprises alkyl polyol glycidyl ether, which accounts for 50-100% by mass percent of the main resin component. The composition is useful in the preparation of prepregs, laminates and printed circuit boards, etc. By using the epoxy resin having the alkyl polyol glycidyl ether molecular structure as the main resin component, the laminates prepared exhibit a low dielectricity while maintaining good thermal property and bonding property. The preparation cost is low, the preparation method is simple, and the prospect of application is broad.
(FR) L'invention concerne une composition de résine d'éther glycidylique de polyol alkylique thermodurcissable et une application associée. La composition de résine selon l'invention contient une résine époxy comme composant de résine principal. La résine époxy contient un éther glycidylique de polyol alkylique, qui représente de 50 à 100 % en masse du composant de résine principal. La composition selon l'invention est utile dans la préparation de préimprégnés, de stratifiés et de cartes de circuits imprimés, etc. L'utilisation de la résine époxy présentant la structure moléculaire d'éther glycidylique de polyol alkylique comme composant de résine principal permet de préparer des stratifiés présentant une diélectricité faible, tout en préservant de bonnes propriétés thermique et de collage. Le coût de préparation de cette composition est faible, son procédé de préparation est simple et ses possibilités d'application sont vastes.
(ZH) 热固性烷基多元醇缩水甘油醚树脂组合物及其应用,所述树脂组合物以环氧树脂作为主体树脂成分,所述环氧树脂包含烷基多元醇缩水甘油醚,所述烷基多元醇缩水甘油醚在主体树脂成分中所占质量百分比为50-100%。所述组合物用于制备半固化片、层压板和印制电路板等,通过使用所述分子结构的烷基多元醇缩水甘油醚结构的环氧树脂作为主体树脂成分,使得制得的层压板在保持较好的热性能和粘结性能的同时,具有低介电性能,并且制备成本低,方法简单,应用前景广阔。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)